Ni纳米颗粒增强Sn58Bi复合钎料/Cu微焊点的组织与性能Microstructure and properties of Ni nanoparticles reinforced Sn58Bi composite solder/Cu micro solder joints
范玉春,张柯柯,陈伟明,吴金娜,张超
摘要(Abstract):
采用机械混合法制备了不同Ni含量的Ni纳米颗粒增强Sn58Bi复合钎料,研究了复合钎料及复合钎料/Cu微焊点的组织与性能。结果表明:添加适量Ni纳米颗粒可细化复合钎料的显微组织,减缓Bi相偏聚粗化;Sn58Bi-0.5Ni复合钎料润湿性较基体钎料提升37.8%;Sn58Bi-0.75Ni复合钎料的拉伸强度、伸长率分别较基体钎料提高15.5%、21.8%。复合钎料和Cu基板可实现良好焊接,微焊点界面金属间化合物(IMC)组织由Cu_6Sn_5转变为(Cu, Ni)_6Sn_5,Sn58Bi-0.75Ni/Cu微焊点剪切强度较基体钎料提高17.9%。随Ni纳米颗粒添加量增加,微焊点剪切断裂途径由IMC层向钎焊界面近钎缝侧移动,断裂机制由以解理+少量二次裂纹的脆性断裂转变为以准解理为主的脆-韧混合断裂。
关键词(KeyWords): Ni纳米颗粒;Sn58Bi复合钎料;金属间化合物;力学性能
基金项目(Foundation): 国家自然科学基金(U1604132);; 中原基础研究领军人才(ZYYCYU202012130);; 河南省国际科技合作项目(重点项目)(241111521400);; 河南省科技攻关项目(242102230048)
作者(Author): 范玉春,张柯柯,陈伟明,吴金娜,张超
DOI: 10.13289/j.issn.1009-6264.2024-0223
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