Cu在Ni-Mo-P镀层的低温扩散行为Diffusion behavior of Cu in Ni-Mo-P coating at low-temperature
王梅玲,杨志刚,张弛
摘要(Abstract):
通过化学镀的方法在Cu基底上制备了不同晶态的Ni-Mo-P镀层,对Ni-1.0 at%Mo-17.0 at%合金镀层进行了200~600℃的真空热处理后,利用X射线荧光光谱仪、X射线衍射仪、俄歇电子能谱仪、能量散射谱仪对样品的厚度、成分、物相结构进行了表征与分析。结果表明,随着P含量的增加,合金镀层的晶态由结晶到混晶、非晶转变。随着热处理温度的增加,镀层本身结晶性提高,Cu原子扩散到镀层中,从而影响镀层的晶态。通过计算可得,400和500℃时,Cu扩散量为4.14 at%、6.14 at%。Cu在Ni-1.0 at%Mo-17.0 at%合金镀层中的扩散激活能为1.11 eV。
关键词(KeyWords): Cu扩散;非晶;X射线衍射
基金项目(Foundation):
作者(Author): 王梅玲,杨志刚,张弛
DOI: 10.13289/j.issn.1009-6264.2014.03.038
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