周宏明,贾洋,李荐,胡雪仪

• 1:中南大学材料科学与工程学院
• 2:湖南省正源储能材料与器件研究所

摘要(Abstract)：

采用中温化学复合镀在高碳钢表面制备了Ni-Cu-P-TiN复合镀层,采用SEM、XRD对镀层的相组成与微观结构进行了分析,并研究了400℃热处理时间对镀层相组成、硬度、耐腐蚀性能的影响。结果表明,TiN相均匀的分散于Ni-Cu-P胞状结构的界面之间,沉积比例在4.5%~5.0%;在400℃下进行恒温热处理,随时间延长,Ni-Cu-P-TiN镀层中逐渐析出细小Ni3P相,截面硬度增加,40min时达到最高硬度960HV;随热处理时间继续延长,Ni3P相的晶粒粗化,镀层硬度下降;镀态Ni-Cu-P-TiN镀层的自腐蚀电流密度为7.92μA,仅为高碳钢(167μA)的1/20,经400℃下恒温热处理0~40min,其自腐蚀电流密度逐渐升高,40min时达到最大值28.2μA。

关键词(KeyWords)： 化学镀;Ni-Cu-P-TiN复合镀层;硬度;热处理

Abstract:

Keywords:

基金项目(Foundation): 湖南省科技计划重点项目(2013GK2025);; 长沙市科技计划项目(k1403375-11);; 清远市清城区产学研合作项目(2013B01)

作者(Author): 周宏明,贾洋,李荐,胡雪仪

DOI: 10.13289/j.issn.1009-6264.2015.s1.037

参考文献(References)：

• [1]Ashassi-Sorkhabi H.Electroless deposition of Ni-Cu-P alloy and study of the influences of some parameters on the properties of deposits[J].Applied Surface Science,2002,185:155-160.
• [2]Gao Y,Zheng Z J,Zhu M,et al.Corrosion resistance of electroless deposited Ni-P and Ni-W-P alloys with various structures[J].Materials Science and Engineering A,2004,381:98-103.
• [3]Sankara Narayanan T S N,Selvakumar S,Stephen A.Electroless Ni-Co-P ternary alloy deposits:preparation and characteristics[J].Surface and Coatings Technology,2003,172:298-307.
• [4]尹付成.化学镀Ni-Cu-P工艺及镀层性能研究[J].常德师范学院学报,1999,11(3):57-59.YIN Fu-cheng.Research on the properties of Electroless Ni-Cu-P coating[J].Journal of Changde Teachers University,1999,11(3):57-59.
• [5]姜晓霞,沈伟.化学镀理论与实践[M].北京:国防工业出版社,2000:426-428.
• [6]李宁,袁伟国,黎德育.化学镀镍基合金理论与技术[M].哈尔滨:哈尔滨工业大学出版社,2000:167-169.
• [7]于光,黎永均.化学镀Ni-Cu-P合金的工艺及镀层性能研究[J].兵器材料科学与工程,1994,17(4):21-26.YU Guang,LI Yong-jun.Process of electroless plating Ni-Cu-P alloy and research on the properties of the coating[J].Ordnance Material Science and Engineering,1994,17(4):21-26
• [8]Sharma A,Singh A K.Corrosion and wear resistance study of Ni-P and Ni-P-PTFE nanocomposite coatings[J].Central European Journal of Engineering,2011,1(3):234-243.
• [9]Alirezaei S,Monirvaghefi S M,Salehi M Saatchi A.Wear behavior of Ni-P and Ni-P-Al2O3 electroless coatings[J].Wear,2007,262:978-985.
• [10]Song Y W,Shan D Y,Chen R S,et al.Study on electroless Ni-P-Zr O2 composite coatings on AZ91D magnesium alloys[J].Surface Engineering,2007,23:334-338.
• [11]Szczygiel B,Turkiewicz A,Seranczuk J.Surface morphology and structure of Ni-P,Ni-P-Zr O2,Ni-W-P,Ni-W-P-Zr O2 coatings deposited by electroless method[J].Surface and Coatings Technology,2008,202:1904-1910.
• [12]Apachitei I,Duszczyk J.Electroless Ni-P composite coatings:the effect of heat treatment on the microhardness of substrate and coating[J].Surface and Coatings Technology,2000,132:89-98.
• [13]Huang X,Wu Y,Qian L.The tribological behavior of electroless Ni-P-Si C(nanometer particles)composite coatings[J].Plating and Surface Finishing,2004,91(7):46-48.
• [14]Mallory G O,Hajdu,J B.Electroless Plating:Fundamentals and Applications[M].Orlando:American Electroplaters and Surface Finishers Society,1990:121
• [15]Bonzzini B,Martini C,Cavallotti P L,Lanzoni E.Relationships among crystallographic structure,mechanical properties and tribological behavior of electroless Ni-P(9%)/B4C films[J].Wear,1999,225/229:806-813.
• [16]洪春福,戴品强,柯学标.脉冲电沉积纳米晶体镍腐蚀特性的研[J].稀有金属材料与工程,2007,36(1):130-133.HONG Chun-fu,DAI Pin-qiang,KE Xue-biao.Corrosion characteristic of nanocrystalline nickel prepared by pulse electrodeposition[J].Rare Metal Materials and Engineering,2007,36(1):130-133.
• [17]Elsener B,Crobu M,Scor M A,et al.Electroless deposited Ni-P alloys:Corrosion resistance mechanism[J].Applied Electrochemistry,2008,38(7):1053-1060.

文章评论(Comment)：