硅对45钢热浸镀铝层真空扩散处理显微组织的影响Influence of silicon on microstructure of hot-dipping Al coating on 45 after during diffusion-treatment in vacuum
赵琦,尹付成,赵满秀,李智
摘要(Abstract):
利用扫描电镜和能谱分析手段研究了铝池中的硅对热浸镀铝层在真空高温扩散处理过程中的显微组织演变的影响。确定了扩散层的组成相,研究了镀层的生长动力学,讨论了扩散层空洞带的形成机理。研究表明,铝池中的硅能减少热浸镀铝层的厚度。在同样的扩散条件下硅的添加抑制了Fe2Al5的生长,促进了FeAl和富铝α-Fe层的生长。扩散处理时从含硅的Fe2Al5中容易析出τ1-(Al,Si)5Fe3相或FeAl相。硅的加入使得FeAl层和富铝α-Fe层间的空洞或晶间裂纹易于早期出现,但随着扩散时间的延长,又逐渐减小或消失。空洞的形成与消失与硅在FeAl层中的富聚有关。由于Fe2Al5相与其中析出的τ1-(Al,Si)5Fe3相发生包共晶反应,即:τ1+Fe2Al5L+FeAl,形成了不连续的外侧FeAl层。
关键词(KeyWords): 热浸镀铝;硅;扩散处理;铁铝化合物;空洞
基金项目(Foundation): 国家自然科学基金资助项目(51071135);; 湖南省自然科学基金资助项目(09JJ3090)
作者(Author): 赵琦,尹付成,赵满秀,李智
DOI: 10.13289/j.issn.1009-6264.2011.10.010
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