王海龙,吴玉程,王德宝,王文芳,宗跃,郑治祥

• 1:合肥工业大学材料学院
• 2:合肥工业大学复合材料高新技术开发有限公司

摘要(Abstract)：

采用机械合金化法制备铜铬粉末,研究了不同球磨时间对粉末颗粒结构、晶粒粒度、显微硬度和表面形貌的影响,用XRD、SEM方法表征Cu-15wt%Cr粉末在不同球磨时间下形成固溶体的结构和表面形貌。结果表明:高能球磨形成了铬固溶于铜的过饱和固溶体,随球磨时间的延长,晶粒逐渐细化,点阵畸变愈来愈大,球磨60h后,粉末呈近球形,畸变率为0.271%,显微硬度为349.18HV。

关键词(KeyWords)： 机械合金化;Cu-Cr粉末;高能球磨;过饱和固溶体

Abstract:

Keywords:

基金项目(Foundation): 安徽省“十五”二期科技攻关项目(040020392);; 合肥市重点科技攻关项目(20051044);; 安徽省自然科学基金(070414180)

作者(Author): 王海龙,吴玉程,王德宝,王文芳,宗跃,郑治祥

参考文献(References)：

• [1]刘德宝,崔春翔.高强高导电铜基复合材料制备技术回顾与展望[J].天津理工学院学报,2003,19(4):29-33.LIU De-bao,CUI Chun-xiang.Review and prospect for fabricating techniques of high strength and electric conductivity copper-matrix composites[J].Journal ofTianjin Institute of Technology,2003,19(4):29-33.
• [2]闵光辉,宋立,于化顺,等.高强度导电铜基复合材料[J].功能材料,1997,28(4):342-345.MIN Guang-hui,SONG Li,YU Hua-shun,et al.High strength and electric conductivity copper-based composites[J].Journal of Functional Materials,1997,28(4):342-345.
• [3]王深强,陈志强,彭德林,等.高强高导铜合金的研究概述[J].材料工程,1995,7:3-6.WANG Shen-qiang,CHEN Zhi-qiang,PENG De-lin,et al.A comprehensive survey of conductivity,high strength copper based alloys[J].Journal ofMaterials Engineering.1995,7:3-6.
• [4]彭北山,宁爱林.提高弥散强化铜合金强度的主要方法[J].冶金丛刊,2004,153(5):4-6.PENG Bei-shan,NING Ai-lin.Major approach to heighten the intension of dispersion-strengthened copper alloy[J].Metallurgical Collections,2004,153(5):4-6.
• [5]钟仁显,卢百平.高强高导铜合金的若干进展[J].铸造技术,2007,28(3):384-387.ZHONG Ren-xian,LU Bai-ping.Some development of high-strength and high-conductivity copper alloys[J].Foundry Technology,2007,28(3):384-387.
• [6]李明茂,杨斌,王智祥.高强高导CuCrZr合金熔炼技术研究[J].特种铸造及有色合金,2005,25(4):252-253.LI Ming-mao,YANG Bin,WANG Zhi-xiang.Smelting of high strength and high conductivity CuCrZr alloy[J].Special Casting and Nonferrous Alloys,2005,25(4):252-253.
• [7]FU Guang-yan,NIU Yan,WU Wei-tao,et al.Oxidation of two-phase Cu-Cr alloys with different microstructures[J].Trans Nonferrous Met Soc China,2001,11(3):333-336.
• [8]王立彬,张成煜,丁秉均.钨或碳添加剂对优化CuCr25合金显微组织的作用[J].稀有金属材料与工程,2003,32(1):41-44.WANG Li-bing,ZHANG Cheng-yu,DING Bing-jun.Influence of W or C adding on the microstructure of CuCr25 alloys[J].Rare Metal Materials andEngineering,2003,32(1):41-44.
• [9]修士新,王季梅.Cr含量对CuCr触头材料性能的影响[J].真空电子技术,1998,1:24-27.XIU Shi-xin,WANG Ji-mei.Effect of Cr content in CuCr contact material on its properties[J].Vacuum Electronics,1998,1:24-27.
• [10]李金平,罗守靖,纪松,等.爆炸烧结CuCr触头材料的性能[J].中国有色金属学报,2001,11(S1):98-101.LI Jin-ping,LUO Shou-jing,JI Song,et al.Characteristics of CuCr contact materials made by explosive sintering[J].The Chinese Journal of NonferrousMetals,2001,11(S1):98-101.
• [11]张瑞丰,沈宁福.快速凝固高强高导Cu-Cr合金的性能[J].中国有色金属学报,2001,11(S1):105.ZHANG Rui-feng,SHEN Ning-fu.Properties of rapidly solidified Cu-Cr alloys with high strength and high conductivity[J].The Chinese Journal of NonferrousMetals,2001,11(S1):105.
• [12]陈振华,陈鼎.机械合金化与固相反应球磨[M].北京:化学工业出版社,2006.
• [13]王尔德,刘京雷,刘祖岩.机械合金化诱导固溶度扩展机制研究进展[J].粉末冶金技术,2002:20(02):109-112.WANG Erde,LIU Jing-lei,LIU Zu-yan.The research progression on the kinetics of extension solid solubility induced by mechanical alloying[J].PowderMetallurgy Technology,2002:20(02):109-112.
• [14]陈仕奇,曲选辉,黄伯云,等.机械合金化Cu50Cr50合金的致密化和组织分析[J].矿冶工程,2000,20(1):59-61.CHEN Shi-qi,QU Xuan-hui,HUANG Bai-yun,et al.Densification and microstructures of Cu50Cr50alloy prepared by mechanical alloying[J].Mining andMetallurgical Engineering,2000,20(1):59-61.
• [15]李世波,谢建新,陈姝,等.机械合金化W-Cu固溶体的形成机理[J].材料科学与工艺,2006,14(4):424-427.LI Shi-bo,XIE Jian-xin,CHEN Shu,et al.Mechanisms of W-Cu solid solution formed by mechanial alloying[J].Materials Science&Technology,2006,14(4):424-427.
• [16]Murty B S,Ranganathan S.Novel material synthesis by mechanical alloying[J].Int Mater Rev,1998,43:101-141.
• [17]Maurice D,Courtney T H.Modeling of mechanical alloying:partⅠ.deformation coalescence,bdand fragmentation mechanisms[J].Metallurgical andMaterials Transactions A,1994,25(1):147-158.

文章评论(Comment)：