W对金刚石/铜复合材料组织及性能影响Effect of W on microstructure and properties of diamond/Cu composites
董应虎,甘海潮,张瑞卿,任学堂,张进
摘要(Abstract):
采用金刚石与W粉混合制备预制坯,然后通过无压浸渗制备金刚石/铜复合材料。采用SEM、XRD、激光热导仪等手段,分析了不同的掺杂量对金刚石/铜复合材料的组织、界面结构及热导率的影响。结果表明,随着W的加入,金刚石与铜的界面结合良好,复合材料的组织更加致密,W元素在界面处富集生成WC、W2C等碳化物。随着掺杂量的增加,复合材料的热导率先升高后下降,最高达到450 W·m~(-1)·K~(-1)。
关键词(KeyWords): 金刚石/铜;无压浸渗;组织;热导率
基金项目(Foundation): 国家自然科学基金(51264033);; 江西省自然科学基金(20132BA206019;20151BAB206012);; 南昌市社科规划项目(JJ201334)
作者(Author): 董应虎,甘海潮,张瑞卿,任学堂,张进
DOI: 10.13289/j.issn.1009-6264.2015.s2.004
参考文献(References):
- [1]刘永正.低成本金刚石/铝复合材料的研究[J].材料导报,2013,27(2):8-11.LIU Yong-zheng.Research on the low-cost diamond/aluminium composites[J].Materials Review,2013,27(2):8-11.
- [2]宋月清,夏扬,谢元锋.金刚石热管理材料的研究进展[J].超硬材料工程,2010,22(1):1-8.SONG Yue-qing,XIA Yang,XIE Yuan-feng.Progress in diamond composites for thermal management materials[J].Superhard Material Engineering,2010,22(1):1-8.
- [3]高文迦,贾成厂,褚克.金刚石/金属基复合新型热管理材料的研究与进展[J].材料导报,2011,25(2):17-22.GAO Wen-jia,JIA Cheng-chang,CHU Ke.Research and advances of diamond/metal composites for thermal management materials[J].Materials Review,2011,25(2):17-22.
- [4]尚青亮,陶静梅,徐孟春,等.电子封装材料用金刚石/铜复合材料的研究进展[J].电字工艺技术,2009,30(1):5-8.SHANG Qing-liang,TAO Jing-mei,XU Meng-chun,et al.Research progress of diamond/Cu composite material for electronic packaging[J].Electronics Process Technology,2009,30(1):5-8.
- [5]龙涛,董应虎,张瑞卿,等.金刚石表面金属化可控Cr层的形成机制及性能[J].材料热处理学报,2015,36(1):132-137.LONG Tao,DONG Ying-hu,ZHANG Rui-qing,et al.Formation mechanism and properties of controllable Cr layer on diamond surface by salt bath plating[J].Transactions of Materials and Heat Treatment,2015,36(1):132-137.
- [6]CHU K,JIA C C,TIAN W H,et al.Thermal conductivity of spark plasma sintering consolidated Si Cp/Al composites containing pores:numerical study and experimental validation[J].Composites Part A:Applied Science and Manufacturing,2010,41(1):161-167.
- [7]唐达培,高庆.钛渡层对CVD金刚石膜热残余应力的影响[J].材料热处理学报,2008,29(1):176-179.GAO Da-pei,GAO Qing.Effect of Ti interlayer on thermal residual stresses of CVD diamond films[J].Transactions of Materials and Heat Treatment,2008,29(1):176-179.
- [8]Nauyoks A S,Wieligor M,Zerda T W,et al.Stress and dislocations in diamond-Si C composites sintered at high pressure high temperature conditions[J].Composites Part A:Applied Science and Manufacturing,2009,40(5):566-572.
- [9]邓安强,樊静波,谭占秋,等.金刚石/铜复合材料在电子封装材料领域的研究进展[J].金刚石与磨料磨具工程,2010,30(5):56-61.DENG An-qiang,FAN Jing-bo,TAN Zhan-qiu,et al.Research progress of diamond/Cu composite material for electronic packaging[J].Diamond&Abrasives Engineering,2010,30(5):56-61.
- [10]马淳安.高活性碳化钨催化材料的制备表征及电化学性能研究[D].上海:上海大学,2006:97-98.MA Chun-an.Characterization Preparation and electrochemical properties of highly active catalytic material WC[D].Shanghai:Shanghai University,2006:97-98.
- [11]吕反修.化学气相沉积金刚石膜的研究与应用进展[J].材料热处理学报,2010,31(1):16-28.LFan-xiu.Progress in research and application development of CVD diamond film[J].Transactions of Materials and Heat Treatment,2010,31(1):16-28.
- [12]CHEN Dai-gang,YU Jia-kang,YU Wei.Effect of coating thickness on thermal conductivity of Ti-coated diamond/Al composites[J].The Chinese Journal of Nonferrous Metals,2013,23(1):802-808.
- [13]宋月清,夏扬,谢元锋,等.金刚石热管理材料的研究进展[J].超硬材料工程,2010,22(1):1673-1433.SONG Yue-qing,XIA Yang,XIE Yuan-feng,et al.Progress in diamond composites for thermal management materials[J].Superhard Material Engineering,2010,22(1):1673-1433.
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