SiCp表面化学镀铜对SiCp/Al复合材料耐蚀性的影响Effect of electroless copper plating on surface of SiCp on corrosion resistance of SiCp/Al composites
邹思云,周贤良,崔霞,华小珍,刘阳
摘要(Abstract):
通过化学镀的方法对碳化硅颗粒表面进行了镀铜改性,采用无压渗透法制备了镀铜碳化硅颗粒铝基复合材料。对碳化硅颗粒镀铜前后SiCp/Al复合材料进行动电位极化曲线和电化学阻抗谱测试。结果表明:SiC颗粒化学镀铜后,颗粒完全由Cu包覆,包覆效果良好;镀铜层对SiCp/Al复合材料界面有影响,所制得的复合材料界面结合良好,镀层抑制了界面相Al_4C_3的生成,促进了界面相CuAl_2的产生;在3.5%NaCl溶液中,碳化硅颗粒镀铜前后SiCp/Al复合材料的腐蚀形式均为以点蚀为主,腐蚀过程相似,但镀铜后SiCp/Al复合材料表面更早形成钝化膜;相对于未镀铜碳化硅制得的SiCp/Al复合材料,化学镀铜后制得的SiCp/Al复合材料早期更易发生腐蚀,但在3.5%NaCl溶液中浸泡较长时间后,腐蚀速率更小。
关键词(KeyWords): 碳化硅;化学镀铜;SiCp/Al复合材料;耐蚀性
基金项目(Foundation): 国家自然科学基金(51262023);; 江西省金属材料微结构调控重点实验室开放基金(JW201323001);江西省金属材料微结构调控重点实验室开放基金(JW201423003)
作者(Author): 邹思云,周贤良,崔霞,华小珍,刘阳
DOI: 10.13289/j.issn.1009-6264.2016-X182
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