杜宜博,周延军,宋克兴,牛立业,郭慧稳

• 1:河南科技大学材料科学与工程学院
• 2:有色金属新材料与先进加工技术省部共建协同创新中心
• 3:中铝洛阳铜加工有限公司

摘要(Abstract)：

对Cu-0.21Cr-0.02Si (mass%)合金进行了980℃×2 h+490℃×(0～6) h的固溶时效热处理，研究了Si对Cu-0.21 mass%Cr合金导电率、屈服强度和富Cr析出相的影响。结果表明：微量Si元素的添加可使Cu-Cr合金的导电率保持在92.5%IACS,同时屈服强度从178 MPa提高到193 MPa; Si元素提高Cu-Cr合金强度主要归功于Si元素对bcc结构富Cr析出相的细化，Si元素细化富Cr析出相主要归因于Si元素促进了富Cr析出相的形核；Cu-Cr-Si合金的析出相主要为fcc结构的富Cr相和bcc结构的富Cr相，bcc结构富Cr相的强化机制为Orowan强化，fcc结构富Cr相的强化机制为共格强化。

关键词(KeyWords)： Cu-Cr-Si合金;导电率;屈服强度;析出相;强化机制

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金面上项目(52173297);; 河南省创新引领专项(191110210400);; 河南省自然科学基金(202300410139);; 中国工程科技发展战略河南研究院战略咨询研究项目(2021HENZDA02)

作者(Author): 杜宜博,周延军,宋克兴,牛立业,郭慧稳

DOI: 10.13289/j.issn.1009-6264.2021-0548

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