固溶与双级时效对含Cu镍基合金组织和硬度的影响Effect of solution and two-stage aging on microstructure and hardness of Cu-containing nickel-based alloys
曾金,栗克建,吕俊杰,赵杰,刘奇,何曲波
摘要(Abstract):
采用光学显微镜(OM)、扫描电镜(SEM)、能谱仪(EDS)、电子背散射衍射(EBSD)和显微硬度仪等研究了含2.7%Cu和0.01%Cu的两组镍基合金试样经固溶与固溶+双级时效后的显微组织和硬度。结果表明:Cu元素对镍基合金显微组织与维氏硬度有重要影响。经1153℃保温2 h后,含2.7%与0.01%Cu试样的平均晶粒尺寸分别增加到121和178μm,激活能分别为3824.44和5603.63 kJ/mol,维氏硬度分别降低至181和149 HV。经1153℃保温1 h再进行双级时效后,含2.7%Cu与0.01%Cu的试样晶粒尺寸分别为75和107μm,维氏硬度分别提高至449和369 HV。含2.7%Cu的试样有细小TiN、含Cu的Laves相弥散分布在晶界与晶间,含0.01%Cu的试样仍有大量呈不连续Laves相分布在基体中。
关键词(KeyWords): 镍基合金;固溶处理;双级时效;微观结构;硬度
基金项目(Foundation): 中国机械工业集团有限公司重大科技专项(SINOMAST-ZDZX-2019-03);; 重庆市总工会2022年创新项目“航空航天用特种高强度耐蚀合金开发”
作者(Author): 曾金,栗克建,吕俊杰,赵杰,刘奇,何曲波
DOI: 10.13289/j.issn.1009-6264.2023-0245
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