中体分SiCp/A1复合材料的热变形行为和功率耗散图Hot deformation behavior and power dissipation map of middle volume fraction SiCp/Al composite
郝世明,谢敬佩,王爱琴,王文炎,李继文
摘要(Abstract):
采用Gleeble-1500热模拟试验机对30%SiCP/2024A1复合材料在温度为623~773 K、应变速率为0.01~10 s-1变形条件下热变形流变行为进行了研究。由试验得出变形过程中的真应力真应变曲线,建立热变形本构方程和功率耗散图。结果表明,复合材料的流变应力随温度的升高而降低,随应变速率的增大而升高,说明该复合材料是一个正应变速率敏感的材料。该复合材料热压缩变形时的流变应力行为可采用Zener-Hollomon参数的双曲正弦形式来描述,热变形激活能Q为571.377 kJ/mol。高温高应变速率条件下的功率耗散系数大,该变形区发生了组织转变。
关键词(KeyWords): 金属基复合材料;本构方程;功率耗散;铝合金;热变形
基金项目(Foundation): 国家自然科学基金(51371077)
作者(Author): 郝世明,谢敬佩,王爱琴,王文炎,李继文
DOI: 10.13289/j.issn.1009-6264.2014.03.006
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