彭伟,江国健,段丽,程曼,肖清,杨锐

• 1:上海应用技术学院材料科学与工程学院

摘要(Abstract)：

采用原位反应无压浸渗工艺,制备了Si C/Al双连续相复合材料,研究烧结温度对Si C/Al双连续相复合材料的导热性能的影响,观察Si C/Al双连续相复合材料的表面形貌。结果表明:Al合金熔体在无压下能渗入三维网状Si C多孔陶瓷孔隙,形成组织均匀具有网络贯穿结构的Si C/Al双连续相复合材料。浸渗温度对复合材料的导热系数影响很大,当浸渗温度为900、1000、1100和1200℃时,复合材料室温下的导热系数分别为167.4、160、154和152 W/(m·K),与浸渗温度900℃相比,浸渗温度1200℃复合材料室温下的导热系数下降了9%。因此,在保证浸渗完全的情况下,随着浸渗温度的升高,复合材料的导热性能越来越差,这主要是由于高温下熔融Al液与Si C陶瓷之间发生界面反应所致;适当地降低熔渗温度可以减缓界面反应的程度,从而提高复合材料的导热性能。本实验的最佳工艺条件为N2气氛,900℃保温3 h。

关键词(KeyWords)： 无压浸渗工艺;双连续相复合材料;三维网状多孔SiC陶瓷;导热性能;界面反应

Abstract:

Keywords:

基金项目(Foundation): 铁道部科技研究开发计划(2010J010-E);; 上海市科学技术委员会(10520501200);; 上海市教育委员会(13ZZ134、14cxy36)

作者(Author): 彭伟,江国健,段丽,程曼,肖清,杨锐

DOI: 10.13289/j.issn.1009-6264.2015.05.010

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