江龙祥,卢金山,曹建尉,王志

• 1:南昌航空大学材料科学与工程学院
• 2:江苏悦丰晶瓷科技有限公司
• 3:中国科学院过程工程研究所湿法冶金清洁生产技术国家工程实验室

摘要(Abstract)：

以冶金硅渣为主要原料,采用水淬粉体直接烧结工艺,制备多孔微晶玻璃。利用XRD、DTA/TG、SEM以及图像分析等技术,研究烧结工艺对多孔微晶玻璃气孔孔径、表观密度、晶相组成以及抗压强度的影响。结果表明:多孔微晶玻璃的气孔孔径随烧结温度升高以及烧结时间延长而增大,随升温速率的增大先增大后减小;表观密度随烧结时间延长逐渐增大,随烧结温度升高和升温速率增大呈现出先减小后增大的趋势;抗压强度随烧结温度升高先缓慢增大后急剧降低。多孔微晶玻璃最佳烧结工艺是以30℃/min的升温速率加热到800℃烧结30 min,此时多孔微晶玻璃的平均孔径为1.2 mm,表观密度为0.81 g/cm~3,抗压强度为4.6 MPa。

关键词(KeyWords)： 冶金硅渣;烧结;微晶玻璃;气孔结构;抗压强度

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金青年科学基金(51404225)

作者(Author): 江龙祥,卢金山,曹建尉,王志

DOI: 10.13289/j.issn.1009-6264.2017-0210

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