热压烧结制备TiC/Cu复合材料的热膨胀性能Thermal expansion properties of TiC/Cu composites prepared by hot pressing sintering
张剑平,孙涛,罗军明,徐吉林
摘要(Abstract):
采用热压烧结制备了TiC10 vol%/Cu复合材料,分别分析了TiC化学镀铜改性和原位形成对TiC/Cu复合材料性能的影响,探讨了固态下TiC颗粒原位形成机制。结果表明:TiC颗粒不经过敏化和活化处理同样可以获得较好的镀铜效果,既降低了镀铜成本,又避免了杂质元素的掺入;固态原位形成TiC的大小与分布受石墨粉的大小和分布控制,而TiC颗粒的形成过程受Ti原子扩散所控制;原位形成的TiC/Cu复合材料具有较高的致密度和较低的膨胀系数,但导电率要低于化学镀铜TiC试样,同时,TiC经化学镀铜处理后,同样可以显著降低复合材料的膨胀系数。
关键词(KeyWords): 热压烧结;铜基复合材料;TiC;微观结构;热膨胀性能
基金项目(Foundation): 国家自然科学基金(52161040)
作者(Author): 张剑平,孙涛,罗军明,徐吉林
DOI: 10.13289/j.issn.1009-6264.2024-0186
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