秦颖,李光芝,董闯

• 1:大连理工大学三束材料改性重点实验室
• 2:大连理工大学高科技研究院

摘要(Abstract)：

通过建立三维温度场模型,利用数值模拟方法,模拟316L钢表面进行Ti和Al合金化的温度场分布,分析Ti、Al涂层厚度以及电子束能量密度对合金化的影响。结果表明,在能量密度为6 J/cm2电子束的一次脉冲处理下,316L钢表面合金化Ti的优化涂层厚度为1.1μm,表面合金化Al的优化涂层厚度为2μm。

关键词(KeyWords)： 强流脉冲电子束;表面合金化;温度场;模拟

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51471043)

作者(Author): 秦颖,李光芝,董闯

DOI: 10.13289/j.issn.1009-6264.2015.11.041

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