姚志浩,董建新,张麦仓,于秋颖,郑磊

• 1:北京科技大学材料科学与工程学院

摘要(Abstract)：

对GH864合金进行3种固溶温度:1040、1060、1080℃×4 h/AC+双时效(845℃×24 h/AC+760℃×16 h/AC)热处理,并对其组织和力学性能进行了研究。结果表明:随着固溶温度的提高,晶粒尺寸出现明显长大,但增长速率越来越小,碳化物连续均匀分布在晶界上,同时,均匀的γ'强化相在基体上弥散析出;在合金性能上,随着固溶温度的提高,合金的高温拉伸伸长率、断面收缩率及室温冲击韧性都逐渐下降;然而,合金的高温815℃抗拉强度基本不变,其高温屈服强度及室温硬度经过1060℃固溶后出现峰值,同时合金的815℃/325 MPa持久性能及高温裂纹扩展速率在该固溶温度下表现出最佳的性能。综合该合金强度和塑性的最佳匹配,确定了GH864合金叶片热处理的最佳固溶温度及时效处理控制工艺为:1060℃×4 h/AC+845℃×24h/AC+760℃×16 h/AC。

关键词(KeyWords)： GH864;固溶处理;显微组织;力学性能

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51071017)

作者(Author): 姚志浩,董建新,张麦仓,于秋颖,郑磊

DOI: 10.13289/j.issn.1009-6264.2011.07.010

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