TD处理制备VC涂层-基体元素扩散与界面特征Element diffusion and interface characteristics of VC coating on die steel prepared by TD process
孔德军,周朝政,吴永忠
摘要(Abstract):
采用热扩散(TD)处理法在冷作模具Cr12MoV表面通过热辐射扩散处理制备了VC涂层,通过扫描电镜、能谱仪和XRD等手段对涂层表面组织结构进行了分析,对结合界面化学元素线能谱进行了分析,并对相互扩散后的冶金结合机理进行了讨论。结果表明,VC涂层是由C和V原子组成,其孔度组织面积百分比为5.71%,晶粒平均直径0.42μm;VC涂层结合界面处化学元素发生了相互扩散,促进冶金结合的形成,其结合强度为47.1 N;热辐射元素扩散过程为涂层中V和C原子向界面和近界面基体扩散,Cr原子主要来自于基体中Cr向涂层中扩散,Si和Mo原子含量没有明显的扩散现象,Fe原子从基体中高含量降低到涂层中低含量,Fe原子热扩散过程被抑制。
关键词(KeyWords): TD处理;结合界面;元素扩散;结合强度
基金项目(Foundation): 常州市应用基础研究计划(CJ20110019);; 江苏省高校自然科学基础研究项目(08KJB430002)
作者(Author): 孔德军,周朝政,吴永忠
DOI: 10.13289/j.issn.1009-6264.2012.08.025
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