许俊华,李浩,喻利花,王贵会,范曦,张豪

• 1:江苏科技大学先进焊接技术江苏省重点实验室
• 2:江苏豪然喷射成形合金有限公司
• 3:上海交通大学金属基复合材料国家重点实验室

摘要(Abstract)：

采用双喷嘴扫描喷射成形工艺制备了大规格50Si50Al电子封装材料的锭坯,经热等静压后尺寸达到400 mm×700 mm。采用扫描电镜和金相显微镜研究了合金的显微组织演变,利用热膨胀仪及万能拉伸试验机检测了合金的热膨胀系数、抗弯强度、抗拉强度。结果表明:利用喷射成形及热等静压制取的Si-Al合金,得到硅相呈均匀弥散分布的组织,部分为骨架状,部分为颗粒状,富Al相围绕Si相间隙呈网络分布。沉积态由于气体滞留及凝固收缩存在三类孔洞,分别为气体滞留型、凝固收缩型及间质性孔洞。50Si50Al合金的这种特殊结构有效地降低了合金的热膨胀系数,室温至200℃的实测值与Turner模型吻合较好。

关键词(KeyWords)： 50Si50Al;喷射成形;热等静压;电子封装

Abstract:

Keywords:

基金项目(Foundation): 江苏省科技支撑计划(BE2009185);; 国家中小企业创新基金(10C26213201152);; 江苏省研究生培养创新工程(CXLX11_0287)

作者(Author): 许俊华,李浩,喻利花,王贵会,范曦,张豪

DOI: 10.13289/j.issn.1009-6264.2013.08.032

参考文献(References)：

• [1]甘卫平,陈招科,杨伏良,等.高硅铝合金轻质电子封装材料研究现状及进展[J].材料导报,2004,18(6):9-82.GAN Wei-ping,CHEN Zhao-ke,YANG Fu-liang,et al.Research status and development of high silicon aluminum alloy for light weight electronicpackage materials[J].Materials Review,2004,18(6):9-82.
• [2]张永安,刘红伟,朱宝宏,等.喷射成形CuCr25合金触头材料的致密化与性能[J].中国有色金属学报,2004,14(8):1372-1375.ZHANG Yong-an,LIU Hong-wei,ZHU Bao-hong,et al.Densification process and properties of CuCr25 alloys from spray forming process[J].TheChinese Journal of Nonferrous Metals,2004,14(8):1372-1375.
• [3]李艳霞,刘俊友,刘国权,等.液固分离法制备Al-65vol%Si电子封装材料组织及性能[J].材料热处理学报,2012,33(3):40-45.LI Yan-xia,LIU Jun-you,LIU Guo-quan,et al.Microstructure and properties of Al-65vol%Si alloy fabricated by a process of liquid and solidseparation[J].Transactions of Materials and Heat Treatment,2012,33(3):40-45.
• [4]朱玉桂,张豪,张林,等.喷射成形7475铝合金的显微组织和力学性能[J].铸造,2010,59(3):235-238.ZHU Yu-gui,ZHANG Hao,ZHANG Lin,et al.Microstructure and mechanical properties of 7475 aluminum alloy by spray forming[J].Foundry,2010,59(3):235-238.
• [5]徐玉冰,马万太,张豪,等.非规则管坯喷射沉积成形工艺优化及试验验证[J].粉末冶金技术,2010,28(1):53-57.XU Yu-bing,MA Wan-tai,ZHANG Hao,et al.Process optimizing and experimental validation of irregular thick-wall tubular billet prepared withreciprocating multi-layers spray forming[J].Powder Metallurgy Technology,2010,28(1):53-57.
• [6]熊柏青.喷射成形技术产业化现状和应用发展方向[J].稀有金属,1999,23(6):425.XIONG Bai-qing.Present situation and development of spray forming technology[J].Chinese Journal of Rare Metals,1999,23(6):425.
• [7]李超,彭超群,余琨,等.喷射沉积70%Si-Al合金电子封装材料的组织与性能[J].中国有色金属学报,2009,19(2):303-307.LI Chao,PENG Chao-qun,YU Kun,et al.Microstructure and properties of spray deposition 70%Si-Al alloy for electronic packaging applications[J].The Chinese Journal of Nonferrous Metals,2009,19(2):303-307.
• [8]王晓峰,赵九洲,田冲.喷射沉积制备新型电子封装材料70%Si-Al的研究[J].金属学报,2005,41(12):1277-1279.WANG Xiao-feng,ZHAO Jiu-zhou,TIAN Chong.Study of novel electronic packaging material 70%Si-Al prepared by the spray deposition[J].ActaMetallurgical Sinica,2005,41(12):1277-1279.
• [9]张永安,刘红伟,朱宝宏,等.新型60Si40Al合金封装材料的喷射成形制备[J].中国有色金属学报,2004,14(1):23-27.ZHANG Yong-an,LIU Hong-wei,ZHU Bao-hong,et al.Novel 60Si40Al alloy packaging material by spray forming process[J].The Chinese Journal ofNonferrous Metals,2004,14(1):23-27.
• [10]王菲,蔡辉,王亚平.用高能球磨法制备的细晶Al-50Si合金的组织与性能[J].材料研究学报,2009,23(5):495-499.WANG Fei,CAI Hui,WANG Ya-ping.The microstructure and properties of fine crystalline Al-50Si alloy prepared by high-energy ball milling[J].Chinese Journal of Materials Research,2009,23(5):495-499.
• [11]S.C.Hogg,A.Lambourne,A.Ogilvy,et al.Microstructural characterisation of spray formed Si-30Al for thermal management applications[J].ScriptaMaterialia,2006,55(1):111-114.
• [12]甄子胜,赵爱民,毛卫民,等.喷射沉积高硅铝合金显微组织及形成机理[J].中国有色金属学报,2000,10(6):815-818.ZHEN Zi-sheng,ZHAO Ai-min,MAO Wei-min,et al.Microstructures and formation mechanism of spray deposited hypereutectic Al-Si alloys[J].TheChinese Journal of Nonferrous Metals,2000,10(6):815-818.
• [13]WANG Xiao-feng,WU Gao-hui,WANG Ri-chu,et al.Fabrication and properties of Si/Al interpenetrating phase composites for electronic packaging[J].Transactions of Nonferrous Metals Society of China,2007,17(2),1039-1042.
• [14]张蓉,黄太文,刘林.过共晶Al-Si合金熔体中初生硅生长特性[J].中国有色金属学报,2004,14(2):262-266.ZHANG Rong,HUANG Tai-wen,LIU Lin.Growth behavior of primary silicon in hypereutectic Al-Si alloy[J].The Chinese Journal of NonferrousMetals,2004,14(2):262-266.
• [15]弭光宝,王晶,何良菊,等.电磁搅拌对Al—Si合金流动性及凝固组织的影响[J].铸造,2010,59(1):16-20.MI Guang-bao,WANG Jing,HE Liang-ju,et al.Influence of electromagnetic stirring on fluidity and solidification structure of Al-Si alloy[J].Foundry,2010,59(1):16-20.
• [16]王小峰,武高辉,修子扬,等.Sip/Al复合材料中的界面和硅相形貌的演变[J].中国有色金属学报,2009,19(3):477-483.WANG Xiao-feng,WU Gao-hui,XIU Zi-yang,et al.Evolution of silicon phase configuration and Si-Al interface of Sip/Al composites[J].TheChinese Journal of Nonferrous Metals,2009,19(3):477-483.
• [17]魏衍广.喷射成形Si-Al电子封装材料的制备及性能研究[D].北京:北京有色金属研究总院,2006:97.WEI yan-guang.Research on producing,microstructures and properties of spray-formed Si-Al alloys used for electronic packaging[D].Beijing:General Research Institute for Nonferrous Metals,2006:97.
• [18]YU Kun,LI Chao,WANG Ri-chu,et al.Production and properties of a spray formed 70%Si-Al alloy for electronic packaging applications[J].Materials Transactions JIM,2008,49(3):685-687.
• [19]李进军,于家康.SiC颗粒增强Al基复合材料的热膨胀性能[J].陕西科技大学学报,2007,25(2):74-78.LI Jin-jun,YU Jia-kang.Thermal expansion properties of silicon carbide particle reinforced aluminum[J].Journal of Shaanxi University of Science&Technology,2007,25(2):74-78.
• [20]张伟,杨伏良,甘卫平,等.电子封装用高硅铝合金热膨胀性能的研究[J].材料导报,2006,20:348-350.ZHANG Wei,YANG Fu-liang,GAN Wei-ping,et al.Study on thermal expansion property of high-silicon aluminum alloy for electronic packaging[J].Materials Review,2006,20:348-350.
• [21]田冲,陈桂云,杨林,等.喷射沉积硅铝电子封装材料的组织与性能[J].功能材料与器件学报,2006,12(1):54-58.TIAN Chong,CHEN Gui-yun,YANG Lin,et al.Microstructures and properties of Si-Al alloy for electronic packaging prepared by spray depositiontechnique[J].Journal of Functional Materials and Devices,2006,12(1):54-58.
• [22]李志辉,张永安,熊柏青,等.快速凝固硅铝合金材料的组织与性能[J].稀有金属材料科学与工程,2010,39(9):659-1663.LI Zhi-hui,ZHAGN Yong-an,XIONG Bai-qing,et al.Microstructure and properties of rapidly solidified silicon-aluminum alloy materials[J].RareMetal Materials and Engineering,2010,39(9):1659-1663.
• [23]胡明.金属基复合材料的热膨胀[J].佳木斯大学学报,2004,22(1):94-100.HU Ming.Thermal expansion of matal matrix composites[J].Journal of Jiamusi University,2004,22(1):94-100.
• [24]师昌绪,李恒德,周廉.材料科学与工程手册(上卷)[M].北京:化学工业出版社,2004.

文章评论(Comment)：