卢泽龙,罗来马,黄新民,谭晓月,丁孝禹,程继贵,朱流,吴玉程

• 1:合肥工业大学材料科学与工程学院
• 2:安徽省有色金属材料与加工实验室
• 3:台州学院机械工程学院

摘要(Abstract)：

研究了一种简化预处理辅助化学镀工艺制备Cu包覆Ti C复合粉末。利用场发射扫描电子显微镜和能谱仪分析了原始Ti C粉末,预处理之后的Ti C粉末,Cu包覆Ti C复合粉末的表面形貌和成分,同时也阐述了Cu镀层的生长机理。结果表明,经过简化预处理之后的Ti C出现了很多表面缺陷,Cu能够均匀的包覆在Ti C颗粒表面。其生长机理如下:经过预处理之后的Ti C出现很多表面缺陷,成为化学镀过程中的活性点;化学镀过程中,Cu在Ti C表面的各个缺陷处形核长大;Cu与Cu之间相互接触相互作用形成密集的网状结构最终形成致密的Cu镀层。

关键词(KeyWords)： 化学镀;Cu包覆Ti C粉末;表面缺陷

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51204064);; 浙江省自然科学基金(Y12E020018)

作者(Author): 卢泽龙,罗来马,黄新民,谭晓月,丁孝禹,程继贵,朱流,吴玉程

DOI: 10.13289/j.issn.1009-6264.2015.s1.044

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