铜铝复合板界面相生长行为Behavior of interface phase growth of Cu/Al composite plate
吕世敬,谢敬佩,王爱琴,毛志平,刘帅洋,田捍卫
摘要(Abstract):
采用铸轧法制备了铜铝复合板,利用SEM,EDS和XRD等分析手段研究了其在300~500℃热处理0.5~8 h下界面层的微观结构和物相成分,从扩散动力学和相变热力学角度探讨了界面相的形成和长大机制。结果表明:铸轧法生产的铜铝复合板界面为3层结构,从铜侧到铝侧依次为Al_4Cu_9层、AlCu层和Al_2Cu层;各界面层扩散系数与温度满足Arrhenius关系,Al_4Cu_9层、AlCu层、Al_2Cu层及整个界面层的生长激活能分别为119.789,94.986,89.259和102.084 k J/mol;在扩散动力学和相变热力学共同作用下,界面处Al_2Cu相最先生成,其次为Al_4Cu_9相,随后在两者之间生成AlCu相。
关键词(KeyWords): 铜铝复合板;界面相;扩散动力学;相变热力学
基金项目(Foundation): 国家自然科学基金(U1604251)
作者(Author): 吕世敬,谢敬佩,王爱琴,毛志平,刘帅洋,田捍卫
DOI: 10.13289/j.issn.1009-6264.2017-0266
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