外能辅助下Sn2.5Ag0.7Cu0.1RE/Cu钎焊接头组织与性能Microstructure and properties of Sn2.5Ag0.7Cu0.1RE/Cu solder joints obtained by ultrosoic-assisted soldering
张晓娇,张柯柯,赵恺,邱然锋,石红信,刘宇杰
摘要(Abstract):
在超声振动外能辅助下进行了Sn2.5Ag0.7Cu0.1RE/Cu钎焊,借助扫描电镜和X衍射等理化检测手段研究了超声振动外能辅助下Sn2.5Ag0.7Cu0.1RE/Cu钎焊接头特性。在超声振动时间为60 s时钎焊点剪切强度达最大值26.0 MPa,较无外能辅助下提高35%;与无外能辅助下钎焊点相比,超声振动外能辅助下钎焊界面Cu6Sn5IMC层厚度、表面粗糙度降低,焊点断裂方式由脆性断裂转变为以韧性断裂为主的混合型断裂。实验结果表明,在超声振动功率88 W的外能辅助下可实现低卤助焊剂下Sn2.5Ag0.7Cu0.1RE/Cu的良好钎焊。
关键词(KeyWords): 超声波;无铅钎料;钎焊;金属间化合物;剪切强度
基金项目(Foundation): 国家自然科学基金资助项目(50774029,U1204520);; 河南省创新型科技团队;; 河南省高校科技创新团队支持计划(13IRTSTHN003)
作者(Author): 张晓娇,张柯柯,赵恺,邱然锋,石红信,刘宇杰
DOI: 10.13289/j.issn.1009-6264.2014.09.014
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