陈海燕,赵敏,揭晓华,郭黎

• 1:广东工业大学材料与能源学院
• 2:高新锡业有限公司

摘要(Abstract)：

为保证锡银铜合金及焊点在低温环境下使用可靠性,将SnAg3.0Cu0.5合金焊料和焊点在25、4、-20和-60℃恒温环境中进行储存565 d后,考察不同温度下SnAg3.0Cu0.5无铅焊料微观组织和物相变化,对经冷储存后SnAg3.0Cu0.5/Cu焊接接头进行拉伸强度和低周疲劳测试。结果表明,焊料经低温储存后没有发生灰锡转变,合金主要由Ag3Sn和β-Sn组成,组织形貌转变为树枝状组织,排列具有一定取向,β-Sn相晶面间距变小,焊料出现低温脆性倾向;随储存温度降低,SnAg3.0Cu0.5焊料与Cu基板互连结构的断裂界面从焊料侧向铜基体方向移动,焊缝的抗拉强度随之下降;在恒幅对称应变条件下,疲劳极限-循环次数曲线的斜率随焊件储存温度降低而变大,焊接接口的抗疲劳性能变差。

关键词(KeyWords)： 无铅焊料;显微组织;低温脆性;低周疲劳

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(20971027)

作者(Author): 陈海燕,赵敏,揭晓华,郭黎

DOI: 10.13289/j.issn.1009-6264.2014.10.016

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