高希瑞,李恒青,韦江,郑宝超,刘洋赈

• 1:上海交通职业技术学院汽车工程学院
• 2:暨南大学先进耐磨蚀及功能材料研究院
• 3:江西省科学院应用物理研究所

摘要(Abstract)：

采用真空热压烧结方法制备了石墨和TiB_2混杂增强Cu基复合材料，研究了烧结温度对复合材料微观结构、致密度、显微硬度、电导率和摩擦磨损性能的影响。结果表明：烧结过程中各粉末原料没有发生氧化，同时粉末之间也没有发生化学反应。两种增强相均匀地分散在连续的Cu基体中，同时颗粒之间没有形成聚集。随着烧结温度的升高，复合材料的致密度和显微硬度先增大后减小，摩擦系数和磨损率先减小后增大，电导率逐渐降低。烧结温度为800℃时，石墨和TiB_2混杂增强Cu基复合材料具有较优异的综合性能，其致密度、显微硬度、电导率、摩擦系数和磨损率分别为98.8%、92.2 HV0.1、43.2%IACS、0.213和1.757×10~(-5) mm~3/(N·m),磨损机制为显微切削为主，粘着磨损为辅。

关键词(KeyWords)： Cu基复合材料;烧结温度;力学性能;摩擦系数;磨损率

Abstract:

Keywords:

基金项目(Foundation): 广东省基础与应用基础研究基金(2020A1515111067);; 浙江省教育厅科技项目(FG2019145);; 江西省科学院博士项目(2018-XTPH1-11,2018-YYB-11)

作者(Author): 高希瑞,李恒青,韦江,郑宝超,刘洋赈

DOI: 10.13289/j.issn.1009-6264.2023-0406

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