热压烧结制备Cu-Al2O3-5Cr复合材料的组织与载流摩擦性能Microstructure and current-carrying friction properties of Cu-Al2O3-5Cr composites prepared by hot pressing sintering
胡琳,邱文婷,周涛,张玉芳,肖柱,李周
摘要(Abstract):
采用真空热压烧结法制备了Cu-Al_2O_3-5Cr(ODS-5Cr)复合材料和Cu-5Cr合金,随后对其进行了固溶、冷轧及时效处理,采用维氏硬度计、扫描电镜、透射电镜、X射线衍射和摩擦磨损试验机等研究了两种材料经不同工艺处理后的显微组织、力学性能及载流摩擦性能。结果表明:经980℃固溶处理4 h、60%冷轧变形及450℃时效处理4 h后,ODS-5Cr复合材料与Cu-5Cr合金的力学性能与导电率得到了提升,硬度分别为154和149 HV0.5,导电率分别为79.6%IACS和82.9%IACS;ODS-5Cr复合材料中弥散分布的纳米Al_2O_3颗粒与位错发生交互作用,对位错及晶界产生钉扎作用,提升了ODS-5Cr复合材料的力学性能、耐磨性能和耐热性能;与Cu-5Cr合金相比,ODS-5Cr复合材料呈现出优异的抗过时效特性;当恒定载荷为2 N、电流为10 A时,ODS-5Cr复合材料的摩擦系数约为0.3,磨损率为5.58×10~(-5) mm~3·N~(-1)·m~(-1),载流摩擦性能优于Cu-5Cr合金,磨损机制主要为磨粒磨损和黏着磨损。
关键词(KeyWords): Cu-Al_2O_3-5Cr复合材料;硬度;导电率;电摩擦磨损
基金项目(Foundation): 广东省重点领域研发计划资助(2024B0101080003)
作者(Author): 胡琳,邱文婷,周涛,张玉芳,肖柱,李周
DOI: 10.13289/j.issn.1009-6264.2024-0582
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