王莹,任凤章,马战红,苏娟华,田保红

• 1:洛阳理工学院土木工程系
• 2:河南科技大学材料科学与工程学院
• 3:河南省有色金属材料科学与加工技术重点实验室

摘要(Abstract)：

采用电镀法在Fe基体上电沉积Cu膜。用悬臂梁法在线测量了沉积过程中的Cu膜内的平均应力,进而研究了Cu膜内的应力分布及应力来源。结果表明,Cu膜内的平均应力和分布应力均为拉应力,它们均随膜厚的增加而减小。Cu膜内的界面应力很大,而生长应力很小。再者,基于改进的Thomas-Feimi-Dirac(TFDC)电子理论,对Fe基体上Cu膜内由界面应力引起的平均应力做出了初步估算。结果表明,理论估算结果与实验结果的应力性质完全相同,其值也较接近。这说明理论计算模型具有一定的准确性。

关键词(KeyWords)： 应力;薄膜;电子密度;电子理论;在线测量

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金资助项目(50771042);; 河南省基础与前沿技术研究计划资助项目(092300410064);; 河南省科技创新人才计划项目(104100510005);; 河南省高校科技创新人才支持计划资助项目(2009HASTIT023)

作者(Author): 王莹,任凤章,马战红,苏娟华,田保红

DOI: 10.13289/j.issn.1009-6264.2010.11.028

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