磁场约束下碳钢表面Ni-W合金电镀层的制备与性能Preparation and properties of electrodeposited nickel-tungsten alloy on carbon steel under magnetic field
高鹏,杨中东,徐小连,陈义庆,钟彬,艾芳芳,李琳
摘要(Abstract):
研究了施加稳恒磁场(0~1 T)对碳钢表面电镀Ni-W合金的影响。测定了不同方向、不同强度稳恒磁场下的电流效率、合金组成及镀层硬度,并用X射线衍射对镀层的微观结构进行了分析。对实验结果进行了分析讨论,找出了稳恒磁场对上述性能的影响规律。结果表明:与不施加磁场相比,施加磁场后镀层的含钨量上升:当磁场方向垂直于电场方向(B⊥J),B=1.0 T时,含钨量上升了约11%;当磁场方向平行于电场方向(B∥J),B=1.0 T时,含钨量上升了约13%;镀层的非晶化程度增强;镀层的硬度提高、孔隙率下降;但Ni-W合金电沉积的电流效率降低。
关键词(KeyWords): 镍钨合金;磁场;电沉积
基金项目(Foundation):
作者(Author): 高鹏,杨中东,徐小连,陈义庆,钟彬,艾芳芳,李琳
DOI: 10.13289/j.issn.1009-6264.2012.04.004
参考文献(References):
- [1]李廷举,金俊泽.材料电磁加工的现状与未来展望[J].材料导报,2000,14(12):12-13.LI Ting-ju,JIN Jun-ze.Current status and future potential for electromagnetic processing of materials[J].Materials Review,2000,14(12):12-13.
- [2]宫明龙,赵骧,宋建宇,等.强磁场对Fe-0.76%C合金共析点的影响[J].材料热处理学报,2009,30(5):1-4.GONG Ming-long,ZHAO Xiang,SONG Jian-yu,et al.Effect of high magnetic field on eutectoid point in Fe-0.76%C alloy[J].Transactions of Materials and Heat Treatment,2009,30(5):1-4.
- [3]Asai S G,Sassa K S,Tahashi M.Crystal orientation of non-magnetic materials by imposition of a high magnetic field[J].Science and Technology of Advanced Materials,2003(4):455-460.
- [4]Krause A,Uhlemann M,Gebert A,et al.The effect of magnetic fields on the electrodeposition of cobalt[J].Electrochimica Acta,2004,49:4127-4134.
- [5]Ootake Y,Sassa K,Yamada T,et al.Control of compositions electrodeposited in a Ni-Zn system by imposition of a high magnetic field[J].JIM,2003(1):1-6.
- [6]赵林,樊占国,杨中东,等.磁场下电沉积制备CuCo颗粒膜的巨磁电阻效应[J].中国有色金属学报,2009,19(5):924-929.ZHAO Lin,FAN Zhan-guo,YANG Zhong-dong,et al.Giant magnetoresistance of CuCo granular films electrodeposited in magnetic field[J].The Chinese Journal of Nonferrous Metals,2009,19(5):924-929.
- [7]方建军,李素芳,査文珂,等.电镀法制备镍-天然石墨复合材料及外加磁场的影响[J].电镀与涂饰,2010,29(9):1-4.FANG Jian-jun,LI Su-fang,ZHA Wen-ke,et al.Electrodeposition of nickel-graphite composite and the effect of external magnetic field[J].Electroplating&Finishing,2010,29(9):1-4.
- [8]Donten M,Cesiulis H,Stojek Z.Electrodeposition and properties of Ni-W,Fe-W and Fe-Ni-W amorphous alloys comparative study[J].Electrochimical Acta,2000,45(20):3389-3396.
- [9]REN Rong,WU Yu-cheng,SHU Xia,et al.Microstructure and performance of electrodeposited nanocrystalline Ni-W alloys[J].Trans Nonferrous Met Soc China,2005,15(3):198-202.
- [10]刘芳,刘常升,陶兴启,等.结晶器铜板表面处理的研究进展[J].表面技术,2006,35(3):1-3.LIU Fang,LIU Chang-sheng,TAO Xing-qi,et al.Progress in surface treatment of copper crystallizer[J].Surface Technology,2006,35(3):1-3.
- [11]Metikos-Hukovic M,Grubac Z,Radic N,et al.Sputter deposited nanocrystalline Ni and Ni-W films as catalysts for hydrogenevolution[J].Journal ofMolecular Catalysis A:Chemical,2006,249(1):172-180.
- [12]Eickemeyer J,Selbmann D,Opitz R,et al.Highly cube textured Ni-W-RABiTS tapes for YBCO coated conductors[J].Physical C,2002,372(2):814-817.
- [13]WU Yi-yong,CHANG Do-yon,KIM Dong-so,et al.Influence of boric acid on the electrodepositing process and structures of Ni-W alloy coating[J].Surface and Coatings Technology,2003,173(2):259-265.
- [14]Donten M,Stojek Z,Cesiulis H.Formation of nanofibers in thin layers of amorphous W alloys with Ni,Co and Fe obtained by electrodeposition[J].Journal of the Electrochemical Society,2003,150(2):95-98.
- [15]刘绍璞.金属化学分析概论与应用[M].四川:四川科学技术出版社,1985:309.
- [16]王森林,洪亮亮.平行电极表面磁场对电沉积钴-镍镀层的影响[J].稀有金属,2007,31(2):211-215.WANG Sen-lin,HONG Liang-liang.Effect of magnetic field parallel to cathodic surface on electro-plating Co-Ni alloy[J].Chinese Journal of Rare Metals,2007,31(2):211-215.
- [17]Matsushiama H,Nohira Y,Mogi L,et al.Effect of magnetic filed on iron electroposotion[J].Surface and Coatings Techology,2004,179:245-251.
- [18]O’Reilly C,Hinds G,Coey J M D.Magnetic field effects on electrodeposition[J].Electrochem Soc,2001,148:674.
- [19]Chaasing E.Mechanism of nickel-molybdenum alloy electrodeposition in citrate electrolytes[J].Appl Electrochem,1989,19:839-845.
- [20]大竹芳文,山田隆志,浅井滋生.强磁塌印加によるNi-Zn系電析物の組織制御[J].日本金属学会志,2003,(1):1-6.
- [21]万小波,张林,周兰,等.电镀非晶态镍钨合金工艺研究[J].材料保护,2006,39(12):23-25.WAN Xiao-bo,ZHANG Lin,ZHOU Lan,et al.Electroplating process amorphous nickel-tungsten alloy coating[J].Materials Protection,2006,39(12):23-25.
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