扩散焊温度对TC4/GH4169接头组织和性能的影响Effect of diffusion welding temperature on microstructure and properties of TC4/GH4169 joint
于卓立,龙伟民,朱世博,常云峰,于兵,邱然锋,于华,江涛,高奇,孙逸翔,李爱国
摘要(Abstract):
在焊接温度分别为860、870、880和890℃,焊接压力为10 MPa,保温时间为60 min的条件下,采用真空扩散焊方法对TC4钛合金和GH4169镍基高温合金异种金属进行焊接。使用扫描电镜(SEM)和能谱仪(EDS)对TC4/GH4169扩散焊接接头的微观组织和断口形貌进行表征,使用万能拉伸试验机对接头进行剪切性能测试。结果表明:TC4/GH4169扩散焊接接头的微观组织根据颜色和形貌,可以分为Ⅰ、Ⅱ、Ⅲ和Ⅳ层;Ⅰ层微观组织形貌呈针状结构,由富Cr和富Ni相的(Ni, Cr, Fe)固溶体组成;Ⅱ层和Ⅲ层是两种母材元素扩散反应区域,呈厚度约为1.5μm的条状结构,分别为Ti(Ni, Fe)和Ti_2Ni相;Ⅳ层位于TC4边缘,主要由主要由浅灰色柳叶状Ti_2Ni相和深灰色连续相α-Ti组成;在890℃/60 min/10.00 MPa焊接工艺时,接头界面微观组织比较致密、无孔洞、无裂纹,接头的剪切强度最高,为155.69 MPa,剪切后接头断口形貌呈现河流状,属于脆性解理断裂。
关键词(KeyWords): 扩散焊;微观组织;剪切强度
基金项目(Foundation): 国家重点研发计划(2022YFB3402200);; 河南省重大科技专项(241100220400)
作者(Author): 于卓立,龙伟民,朱世博,常云峰,于兵,邱然锋,于华,江涛,高奇,孙逸翔,李爱国
DOI: 10.13289/j.issn.1009-6264.2025-0321
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