吴婉,张柯柯,吴咏锦,王冰莹,刘鹏,肖娜

• 1:河南科技大学材料科学与工程学院
• 2:黄河科技学院

摘要(Abstract)：

采用化学镀法对ZrO_2进行表面镀Cu处理，制备镀铜氧化锆(Cu-ZrO_2)增强低银Sn1.0Ag0.5Cu复合钎料，对复合钎料及其钎焊接头组织性能进行了研究。结果表明：采用化学镀法可实现氧化锆表面镀铜纳米粒子的制备，两者具有较高的吸附力；添加适量Cu-ZrO_2可细化Cu-ZrO_2增强低银Sn1.0Ag0.5Cu复合钎料中初生β-Sn晶粒，增加共晶组织比例，提高钎料的润湿性和抗拉强度，当Cu-ZrO_2添加量为0.5 mass%时，Cu-ZrO_2增强低银Sn1.0Ag0.5Cu复合钎料的抗拉强度达41.6 MPa,与未添加Cu-ZrO_2的Sn1.0Ag0.5Cu钎料相比提高了38%;添加Cu-ZrO_2还可提高Cu-ZrO_2增强低银Sn1.0Ag0.5Cu复合钎料钎焊接头的剪切强度，当Cu-ZrO_2添加量为0.5 mass%时，钎焊接头的剪切强度达28.5 MPa,较未添加Cu-ZrO_2的钎焊接头提高了41.9%;钎焊接头断裂途径从界面金属间化合物(IMC)层向钎焊界面的近钎缝侧方向移动，断裂机制也由韧窝和解理刻面组成的韧-脆混合性断裂向以韧窝为主的韧性断裂转变。

关键词(KeyWords)： 镀铜氧化锆;Sn1.0Ag0.5Cu钎料;钎焊;显微组织;力学性能

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(U1604132);; 中原英才计划-中原领军人才(ZYYCYU002130)

作者(Author): 吴婉,张柯柯,吴咏锦,王冰莹,刘鹏,肖娜

DOI: 10.13289/j.issn.1009-6264.2022-0174

参考文献(References)：

• [1] Han Y D,Gao Y,Zhang S T,et al.Study of mechanical properties of Ag nanoparticle-modified graphene/Sn-Ag-Cu solders by nanoindentation[J].Materials Science and Engineering A,2019,761:138051-138054.
• [2] Wang H,Zhang K,Zhang M.Fabrication and properties of Ni-modified graphene nanosheets reinforced Sn-Ag-Cu composite solder[J].Journal of Alloys & Compounds,2019,781:761-772.
• [3] 何凯，陈益平，程东海，等.Ag颗粒含量对SnAgCu基复合钎料组织及性能的影响[J].材料热处理学报，2019,40(7):172-176.HE Kai,CHEN Yi-ping,CHENG Dong-hai,et al.Effect of Ag particle content on microstructure and mechanical properties of SnAgCu-based composite solder[J].Transactions of Materials and Heat Treatment,2019,40(7):172-176.
• [4] El-Daly A A,Desoky W M,Elmosalami T A,et al.Microstructural modifications and properties of SiC nanoparticles-reinforced Sn-3.0Ag-0.5Cu solder alloy[J].Materials & Design,2015,65:1196-1204.
• [5] Huo F,Shen Y A,He S,et al.Fabrication of NiO/ZrO2 nanocomposites using ball milling-pyrolysis method[J].Vacuum,2021,191:110370.
• [6] 孙磊，陈明和，谢兰生，等.纳米铝颗粒增强Sn1.0Ag0.5Cu钎料性能及机理[J].焊接学报，2018,39(8):47-50.SUN Lei,CHEN Ming-he,XIE Lan-sheng,et al.Properties and mechanism of Sn1.0Ag0.5Cu filler metal reinforced by aluminum nanoparticles [J].Transactions of the China Welding Institution,2018,39(8):47-50.
• [7] 王晓飞，金程凯，方运琪，等.微合金化低银无镉Ag-Cu-Zn钎料的性能[J].机械工程材料，2021,45(12):6-7.WANG Xiao-fei,JIN Cheng-kai,FANG Yun-qi,et al.Microalloying properties of low silver cadmium free Ag-Cu-Zn solder[J].Mechanical Engineering Materials,2021,45(12):6-7.
• [8] Hong B,Yz C,Xsab C,et al.Reactive wetting and interfacial characterization of ZrO2 by SnAgCu-Ti alloy[J].Ceramics International,2019,45(6):6730-6737.
• [9] Mahim Z,Salleh M,Saud N,et al.Physical properties of Sn-3.0Ag-0.5Cu lead-free solder with the additional of SiC particles[J].IOP Conference Series Materials Science and Engineering,2019,701:012030.
• [10] Gain A K,Fouzder T,Chan Y C,et al.Microstructure,kinetic analysis and hardness of Sn-Ag-Cu-1wt% nano-ZrO2 composite solder on OSP-Cu pads[J].Journal of Alloys and Compounds,2011,509(7):3319-3325.
• [11] Gain A K,Zhang L.Microstructure,mechanical and electrical performances of zirconia nanoparticles-doped tin-silver-copper solder alloys[J].Journal of Materials Science Materials in Electronics,2016,27(7):7524-7533.
• [12] 曹天泽.ZnO纳米颗粒增强SnAgCu无铅钎料的可靠性研究[D].北京：北方工业大学，2019.CAO Tian-ze.Study on the reliability of SnAgCu lead-free solder reinforced by ZnO Nanoparticles [D].Beijing:North China University of Technology,2019.
• [13] Huo F,Zhang K,Zhang M,et al.Microstructure and properties of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1RE composite soldering joints[J].Journal of Henan University of Science and Technology(Natural Science),2019,40(2):6-10.
• [14] Jing H Y,Guo H J,Wang L X,et al.Influence of Ag-modified graphene nanosheets addition into Sn-Ag-Cu solders on the formation and growth of intermetallic compound layers[J].Journal of Alloys and Compounds,2017,702:669-678.
• [15] Li X,Ma Y,Zhou W,et al.Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys[J].Materials Science and Engineering A,2016,684:328-334.
• [16] 陈进，屈敏，崔岩.镀镍多壁碳纳米管对Sn-3.0Ag-0.5Cu无铅钎料焊点界面行为的影响[J].金属热处理，2021,46(12):113-118.CHEN Jin,QU Min,CUI Yan.Effect of Ni coated carbon nanotubes on interface behavior of Sn-3.0Ag-0.5Cu Lead-free solder joints [J].Heat Treatment of Metals,2021,46(12):113-118.
• [17] Zaimi N,Salleh M,Sandu A V,et al.Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing[J].Materials,2021,14(4):776-776.
• [18] Khodabakhshi F,Sayyadi R,Javid N S.Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying:Microstructural evolution and mechanical durability[J].Materials Science and Engineering A,2017,702(15):371-385.
• [19] 徐道兵，龙威，周小平.粉末冶金Al3(Zr,Ti)/Al复合材料的组织与性能[J].材料热处理学报，2020,41(4):19-25.XU Dao-bing,LONG Wei,ZHOU Xiao-ping.Microstructure and properties of powder metallurgy Al3(Zr,Ti)/Al composites[J].Transactions of Materials and Heat Treatment,2020,41(4) :19-25.
• [20] Chen G,Wu F S,Liu C Q,et al.Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets[J].Journal of Alloys & Compounds,2016,656:500-509.
• [21] 张胜利，宋克兴，国秀花，等.TiB2颗粒混杂对TiB2/Cu复合材料微观组织和性能的影响[J].材料热处理学报，2018,39(8):7-13.ZHANG Sheng-li,SONG Ke-xing,GUO Xiu-hua,et al.Effect of mixing TiB2 particles on microstructure and properties of TiB2/Cu composites[J].Transactions of Materials and Heat Treatment,2018,39(8):7-13.
• [22] 许海，李钊，王俊峰，等.SPS烧结原位制备Al2O3-TiC增强Cu基复合材料的组织与性能[J].材料热处理学报，2018,39(5):10-16.XU Hai,LI Zhao,WANG Jun-feng,et al.Microstructure and properties of in-situ Al2O3-TiC/Cu composites prepared by SPS method[J].Transactions of Materials and Heat Treatment,2018,39(5):10-16.
• [23] Kumar K M,Kripesh V,Andrew A O.Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders[J].Journal of Alloys and Compounds,2006,450(1):229-237.
• [24] Ping L,Pei Y,Liu J.Effect of SiC nanoparticle additions on microstructure and microhardness of Sn-Ag-Cu solder alloy[J].Journal of Electronic Materials,2008,37(6):874-879.
• [25] Wang Y L,Zhang K K,Li C Y,et al.The morphology and evolution of Cu6Sn5 at the interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu solder joint during the isothermal aging[J].Materials Science Forum,2011,704-705:685-689.

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