钴锑钪合金化足金材料的硬化行为Hardening behavior of Co-Sb-Sc alloying pure gold
袁军平,李桂双,陈德东,马春宇,王昶
摘要(Abstract):
传统足金的硬度很低,制约了首饰的艺术价值。采用钴、锑、钪对纯金进行微合金化处理,研究了改性足金的显微组织和硬化行为。试验结果表明,改性足金(含金量99.31 mass%)的铸态硬度可达到62 HV,经700℃固溶处理后组织呈现单一固溶体结构,硬度可达到51 HV。固溶态材料经冷变形处理时,形变量为80%时硬度达到121 HV,再经250℃时效处理后出现了弥散分布的沉淀析出相,晶粒组织比传统足金显著细化,硬度达到了138 HV。改性足金的硬化行为是合金元素固溶强化、细晶强化、形变强化和析出强化综合作用的结果。
关键词(KeyWords): 足金;微合金化;硬化
基金项目(Foundation): 广东高校珠宝首饰工程技术开发中心建设项目(粤教科函【2012】131号)
作者(Author): 袁军平,李桂双,陈德东,马春宇,王昶
DOI: 10.13289/j.issn.1009-6264.2015.05.002
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