纯铜动态再结晶的三维元胞自动机模拟Modeling for dynamic recrystallization of pure copper with 3-dimensional cellular automaton method
柳文波,张弛,杨志刚,许峰云
摘要(Abstract):
用三维元胞自动机法(CA法)模拟纯铜在400℃以0.0005s-1的应变率发生动态再结晶(DRX)的过程。给出了母相和再结晶晶粒的平均位错密度随着应变量的变化规律;根据平均位错密度的变化研究了纯铜动态再结晶中形核、长大、动态回复和加工硬化等过程。模拟了纯铜动态再结晶过程中的应力-应变曲线及平均晶粒尺寸的变化规律,模拟结果与文献中的试验结果吻合较好。
关键词(KeyWords): 位错密度;三维;动态再结晶;元胞自动机
基金项目(Foundation): 国家自然科学基金资助项目(50871059);; 教育部留学回国基金项目
作者(Author): 柳文波,张弛,杨志刚,许峰云
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