张进峰,吴晓春,闵娜,金明江

• 1:苏州市职业大学电子信息工程学院
• 2:苏州微加测试仪器有限公司
• 3:上海大学材料科学与工程学院
• 4:上海大学测试分析中心

摘要(Abstract)：

通过电阻法对淬火态SDCM1热作模具钢从室温～200℃回火过程进行动态表征，采用三维原子探针(3DAP)显微组织分析技术分析淬火态和回火态试样各元素原子的三维空间分布及在选区空间的浓度变化，结合淬火态试样在室温～200℃加热过程中硬度变化分析低温回火过程中碳原子扩散行为。结果表明：淬火态试样低温回火后碳元素在局部区域出现明显的偏聚，合金元素Mn、Mo、Cr等几乎分布均匀；室温至70℃回火时电阻随温度的升高而增加主要是声子散射电子引起的；70℃至125℃回火时电阻偏离原有线性上升趋势，增幅变缓，随后呈现下降趋势，为该温度区间碳原子短程扩散偏聚散射电子作用减弱所致；120℃附近出现与电阻峰特征吻合的硬度峰值，归因为碳原子向位错扩散偏聚钉扎位错。

关键词(KeyWords)： 热作模具钢;碳扩散;硬度;电阻法;三维原子探针

Abstract:

Keywords:

基金项目(Foundation): 省部共建高品质特殊钢冶金与制备国家重点实验室自主课题(SKLASS2022-Z12);; 苏州市职业大学科研项目(KY20230422)

作者(Author): 张进峰,吴晓春,闵娜,金明江

DOI: 10.13289/j.issn.1009-6264.2025-0165

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