揭晓,钟强强,李钊,陈金水,肖翔鹏

• 1:台州科技职业学院
• 2:浙江惟精新材料股份有限公司
• 3:江西理工大学材料冶金化学学部

摘要(Abstract)：

采用中频感应熔炼炉制备了4种不同Sn含量的Cu-3Ni-0.75Si-0.1Mg-xSn合金,研究了Sn添加对Cu-3Ni-0.75Si-0.1Mg合金高温抗软化性能的影响及其作用机理。结果表明,Sn元素的添加可提高合金的峰值硬度,且随着Sn含量的增加,其提升效果更显著;0.6%Sn元素的添加可提高Cu-3Ni-0.75Si-0.1Mg合金的抗软化温度,这与Sn元素的添加阻碍合金回复和再结晶行为有关;Cu-3Ni-0.75Si-0.1Mg-xSn合金在不同温度区间的退火软化机理不同,低温退火时(450～500℃),退火软化与回复相关;中温退火时(500～600℃),退火软化主要受回复和再结晶影响;当退火温度过高时(>600℃),退火软化主要受第二相粒子的粗化影响。

关键词(KeyWords)： Sn添加;Cu-3Ni-0.75Si-0.1Mg合金;高温抗软化;软化机理

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51561008)

作者(Author): 揭晓,钟强强,李钊,陈金水,肖翔鹏

DOI: 10.13289/j.issn.1009-6264.2020-0517

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