梁十军,刘海涛,张彦敏,宋克兴,郭慧稳,郭引刚

• 1:河南科技大学材料科学与工程学院
• 2:河南省科学院
• 3:中铝洛阳铜加工有限公司
• 4:河南中原黄金冶炼厂有限责任公司

摘要(Abstract)：

利用光学显微镜(OM)、透射电镜(TEM)和电导率测试等研究了添加微量合金化元素对4N纯铜的晶粒尺寸热稳定性和导电性的影响，分析了合金元素与基体中微量杂质元素S的相互作用。结果表明：添加微量Ti元素及微量Cr、Ni和Ag元素均可显著提高4N纯铜晶粒尺寸的热稳定性，经900℃×30 min高温处理后，Cu、Cu-Ti和Cu-Cr-Ni-Ag的晶粒尺寸分别为158.57、86.06和48.35μm,即热稳定性Cu-Cr-Ni-Ag>Cu-Ti>Cu。同时，添加微量合金化元素后纯铜的导电率仍较高，Cu、Cu-Ti和Cu-Cr-Ni-Ag导电率分别为101.87、101.64和99.98%IACS。分析认为热稳定性的提高主要与TiS相、CrS相的钉扎以及Ni和Ag固溶拖拽有关，微量Ti和Cr可与杂质S反应形成六方结构TiS相和单斜结构CrS相，且均与基体呈非共格关系，特别是CrS相较TiS相更为细小、数量更多。

关键词(KeyWords)： 纯铜;微合金化元素;电导率;热稳定性;析出相

Abstract:

Keywords:

基金项目(Foundation): 河南省重点研发专项(221111230600);; 中原学者工作站项目(224400510025);; 洛阳市重大科技创新专项(2201017A);; 国家自然科学基金(52071133)

作者(Author): 梁十军,刘海涛,张彦敏,宋克兴,郭慧稳,郭引刚

DOI: 10.13289/j.issn.1009-6264.2023-0548

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