刘勇,耿昊,李国辉,田保红,顾正彬,张毅

• 1:河南科技大学材料科学与工程学院
• 2:河南省有色金属材料科学与加工技术重点实验室
• 3:中国船舶重工集团公司第七一三研究所
• 4:南京大学材料科学与工程系

摘要(Abstract)：

采用粉末冶金法制备Al_2O_3/Cu和Cr30/Cu复合材料,采用熔渗法制备W80/Cu(-Al_2O_3)复合材料,观察其微观组织,测试其真空电击穿性能。结果表明:Al_2O_3/Cu和Cr30/Cu复合材料有较低的截流值,Cr30/Cu复合材料有较高的耐电压强度,且燃弧时间更加稳定;在W80/Cu复合材料中引入Al_2O_3强化粒子能提高其耐电压强度,降低截流值;Al_2O_3/Cu和Cr30/Cu复合材料电弧烧蚀区域均匀分散,而W/Cu复合材料电弧侵蚀集中,侵蚀坑较深,但能减弱熔融金属喷溅;Cr30/Cu复合材料抗真空电击穿性能最优。

关键词(KeyWords)： 真空电击穿;铜基复合材料;燃弧时间;截流值;耐电压强度

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(U201704143);; 河南省科技开放合作项目(182106000018)

作者(Author): 刘勇,耿昊,李国辉,田保红,顾正彬,张毅

DOI: 10.13289/j.issn.1009-6264.2018-0157

参考文献(References)：

• [1]吴细秀,狄美华,李震彪,等.电触头侵蚀研究概述[J].低压电器,2003(5):6-11.WU Xi-xiu,DI Mei-hua,LI Zhen-biao,et al.A review on the development of electrode erosion[J].Low Voltage Apparatus,2003(5):6-11.
• [2]闫超杰,张晓燕,王文平,等.Cu Ni电触点材料的直流电弧侵蚀研究[J].电工材料,2008(4):14-16.YAN Chao-jie,ZHANG Xiao-yan,WANG Wen-ping,et al.Study on DC arc erosion of Cu Ni electrical contact material[J].Electrical Engineering Materials,2008(4):14-16.
• [3]钱宝光,耿浩然,郭忠全,等.电触头材料的研究进展与应用[J].机械工程材料,2004,28(3):7-9.QIAN Bao-guang,GENG Hao-ran,GUO Zhong-quan,et al.Development and application of electrical contact materials[J].Materials for Mechanical Engineering,2004,28(3):7-9.
• [4]邵文柱,崔玉胜,杨德庄,等.电触头材料的发展与现状[J].电工材料,1999(1):11-35.SHAO Wen-zhu,CUI Yu-sheng,YANG De-zhuang,et al.Development and current situation of electrical contact material[J].Electrical Engineering Materials,1999(1):11-35.
• [5]ZHAO Nai-qin,LI Jia-jun,YANG Xian-jin.Influence of the P/M process on the microstructure and properties of WC reinforced copper matrix composite[J].Journal of Materials Science,2004,39(15):4829-4834.
• [6]孙财新,王珏,严萍.两种铜基触头材料的电弧侵蚀性能研究[J].高压电器,2012,48(1):82-89.SUN Cai-xin,WANG Jue,YAN Ping.Investigation of arc erosion performances of two copper-based electrical contact materials[J].High Voltage Apparatus,2012,48(1):82-89.
• [7]Slade P G.Advance in materials development for high power vacuum interrupter contacts[J].IEEE Transactions on Components,Packaging,and Manufacturing Technology,Part A,1994,17(1):96-106.
• [8]赵来军,李震彪,王珂,等.纳米Cu Cr50触头材料电弧侵蚀特性[J].高压电器,2012,48(5):15-19.ZHAO Lai-jun,LI Zhen-biao,WANG Ke,et al.Arc erosion characteristics of nanocrystalline Cu Cr50 contact material[J].High Voltage Apparatus,2012,48(5):15-19.
• [9]Li W P,Thomas R L,Smith R K,et al.Effects of Cr content on the interruption ability of Cu Cr contact materials[J].IEEE Transactions on Plasma Science,2001,29(5):744-748.
• [10]王珩,李素华,刘立强,等.Cu W电触头材料研究综述[J].电工材料,2014(5):11-17.WANG Heng,LI Su-hua,LIU Li-qiang,et al.Research review on Cu W electrical contact materials[J].Electrical Engineering Materials,2014(5):11-17.
• [11]Yang X H,Liang S H,Wang X H,et al.Effect of WC and Ce O2on microstructure and properties of W-Cu electrical contact material[J].International Journal of Refractory Metals and Hard Materials,2010,28(2):305-311.
• [12]陈文革,陈勉之,邢力谦,等.掺杂对WCu电触头材料电弧侵蚀特性的影响[J].中国有色金属学报,2009,19(11):2029-2037.CHEN Wen-ge,CHEN Mian-zhi,XING Li-qian,et al.Effect of doping on electrical arc characteristic of WCu electrical contact materials[J].The Chinese Journal of Nonferrous Metals,2009,19(11):2029-2037.
• [13]Qian K,Liang S H,Xiao P.In situ synthesis and electrical properties of Cu W-La2O3composites[J].International Journal of Refractory Metals and Hard Materials,2012,31(3):147-151.
• [14]Wang X H,Liang S H,Yang P,et al.Effect of Al2O3particle size on vacuum breakdown behavior of Al2O3/Cu composite[J].Vacuum,2009,83:1475-1480.
• [15]Wang X H,Liang S H,Yang P,et al.Effect of Al2O3content on electrical breakdown properties of Al2O3/Cu composite[J].Journal of Materials Engineering and Performance,2010,19(9):1330-1336.
• [16]刘爱辉,丁红燕,周广宏,等.原位Al2O3颗粒增强铜基复合材料的微动磨损[J].材料热处理学报,2012,32(S1):20-23.LIU Ai-hui,DING Hong-yan,ZHOU Guang-hong,et al.Fretting wear mechanism of Cu matrix composite reinforced by in-situ Al2O3particle[J].Transactions of Materials and Heat Treatment,2012,32(S1):20-23.
• [17]杨志强,刘勇,田保红,等.Ti C颗粒增强弥散铜基复合材料的动态再结晶[J].材料热处理学报,2013,33(S2):6-9.YANG Zhi-qiang,LIU Yong,TIAN Bao-hong,et al.Dynamic recrystallization of Ti C particle reinforced dispersion-strengthened copper mtrix composites[J].Transactions of Materials and Heat Treatment,2013,33(S2):6-9.
• [18]冯江,田保红,孙永伟,等.弥散铜-WC复合材料的热变形行为及动态再结晶临界条件[J].材料热处理学报,2013,33(7):19-23.FENG Jiang,TIAN Bao-hong,SUN Yong-wei,et al.Hot deformation behavior and critical conditions of dynamic recrystallization of Al2O3/Cu-WC composites[J].Transactions of Materials and Heat Treatment,2013,33(7):19-23.
• [19]许玮,胡锐,刘懿文,等.Gra./Cu和CNTs/Cu复合材料的截流值与阴极斑点研究[J].稀有金属材料与工程,2011,40(9):1616-1620.XU Wei,HU Rui,LIU Yi-wen,et al.Chopping current and cathode spot movements of Gra./Cu and CNTs/Cu composites[J].Rare Metal Materials and Engineering,2011,40(9):1616-1620.

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