焊锡接头冷热循环组织性能演化及失效机理Microstructure and properties evolution and failure mechanism of solder joints after thermal cycling
王冬梅,刘广通,有移亮,张诚,张伟
摘要(Abstract):
焊锡接头是卫星舱外线缆与器件引脚的常见连接方式,卫星在服役过程中舱外温度存在较大的波动,焊锡接头是易发生失效的部位之一。为研究焊锡接头的组织性能演化规律和失效机理,对其开展了-160~160℃范围内的冷热循环试验,并利用光学显微镜、显微硬度计、扫描电镜和有限元分析等对样品进行了分析。结果表明:冷热循环过程中焊料组织发生了粗化,Pb元素从富Sn相中析出并在富Pb相中发生团聚,晶界和相界发生弱化。由于引脚与焊料之间的热膨胀系数相差较大,使得冷热循环过程中靠近引脚表面的焊料存在较大的热应力,从而促进了该位置处Pb的析出和焊料组织粗化,造成富Pb相与基体相脱离并形成微裂纹。微裂纹在热应力的作用下发生扩展并相互连接,最终引发焊锡接头的整体开裂。
关键词(KeyWords): 焊锡;冷热循环;膨胀系数;组织偏聚
基金项目(Foundation): 国家重点研发计划(2017YFC0805701);; 中国航天科技集团有限公司工艺专项GYGY2017-08《卫星舱外线缆装配及连接工艺技术研究》;; 教育部产学合作协同育人项目(201902206001)
作者(Author): 王冬梅,刘广通,有移亮,张诚,张伟
DOI: 10.13289/j.issn.1009-6264.2022-0254
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