韩念梅,冯迪,陈家劲,吴彤,张保玲,唐建国

• 1:苏州工业职业技术学院精密制造学院
• 2:江苏科技大学材料科学与工程学院
• 3:江苏豪然喷射成形合金有限公司
• 4:中南大学材料科学与工程学院

摘要(Abstract)：

采用光学显微镜、扫描电镜、显微硬度计及电子万能试验机等对不同焊前状态下的喷射沉积7055铝合金搅拌摩擦焊接接头的组织与性能进行了研究。结果表明：热挤压板材的焊接接头硬度由母材区向焊核区逐渐升高，焊核区平均硬度为167 HV20,接头最大抗拉强度为291 MPa,断裂伸长率为4.3%,断裂位置位于母材区；峰时效态板材的焊接接头硬度由母材区向焊核区先降低再升高，母材区平均硬度为200 HV20,焊核区硬度为162 HV20,接头最大抗拉强度达到361 MPa,断裂伸长率为3.8%,断裂位置位于热影响区和热力影响区的分界区域。两种板材的焊核区和热力影响区都表现出剧烈的动态再结晶行为。热挤压态板材和峰时效态板材焊接接头的热影响区分别出现亚微米第二相回溶行为和纳米析出相的粗化行为。两种板材的焊核区和热力影响区的强化效应都包括细晶强化、固溶强化和亚结构强化。热影响区内的晶界粗大第二相不受变形热的影响，其强化机制表现为固溶强化和亚结构强化。

关键词(KeyWords)： 7055铝合金;焊前状态;喷射沉积;搅拌摩擦焊;焊接接头

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51474240,51801082);; 江苏省高校基础科学研究重大项目(23KJA460012)

作者(Author): 韩念梅,冯迪,陈家劲,吴彤,张保玲,唐建国

DOI: 10.13289/j.issn.1009-6264.2024-0504

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