许媛媛,闫焉服,王新阳,王红娜,马士涛

• 1:河南科技大学材料科学与工程学院
• 2:河南科技大学车辆与交通工程学院

摘要(Abstract)：

研究了不同钎焊时间下Sn-3.0Ag-0.5Cu/Cu焊点界面金属间化合物生长变化规律和剪切强度变化。结果表明:随着钎焊时间增加,界面化合物平均厚度逐渐增加,且生长的时间指数为0.4。钎焊60s内界面化合物的生长速率较大;随着钎焊时间的增加,钎焊接头的抗剪切强度先增加后降低,这与界面处脆硬相Cu6Sn5生长行为密切相关。

关键词(KeyWords)： 界面化合物;钎焊时间;厚度;抗剪切强度

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51175151)

作者(Author): 许媛媛,闫焉服,王新阳,王红娜,马士涛

DOI: 10.13289/j.issn.1009-6264.2015.03.013

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