陈国钦,修子扬,朱德智,张强,武高辉

• 1:哈尔滨工业大学材料科学与工程学院
• 2:哈尔滨工业大学基础与交叉科学研究院

摘要(Abstract)：

采用挤压铸造法制备了SiC颗粒体积分数分别为50%、55%和60%的SiCp/Cu复合材料,并分析测试了体积分数和热处理状态对复合材料热膨胀性能的影响规律。显微组织观察表明:复合材料的组织致密,SiC颗粒分布均匀。热膨胀性能测试表明:铸态复合材料的平均线热膨胀系数(20～100℃)介于8.8～9.9×10-6/℃之间,且随SiC含量的增加而降低,实验值与Kerner模型预测值相符。退火处理可以减小基体中的热残余应力,有助于降低复合材料的热膨胀系数,退火态复合材料的热膨胀系数实验值与Turner模型预测值相符。

关键词(KeyWords)： 电子封装;SiCp/Cu复合材料;热膨胀系数;退火处理

Abstract:

Keywords:

基金项目(Foundation): 中国博士后科学基金资助项目(20080430895);; 哈尔滨市科技创新人才研究专项资金项目(2008RFQXG045)

作者(Author): 陈国钦,修子扬,朱德智,张强,武高辉

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