刘德宝,陈民芳,沈荣臻,崔春翔

• 1:天津理工大学材料科学与工程学院
• 2:河北工业大学材料科学与工程学院

摘要(Abstract)：

对Cu-Ti合金原位渗氮法制备TiNP/Cu复合材料进行试验研究。结果表明:可以通过高能球磨制备亚稳态Cu-Ti合金粉,然后渗氮的方式制备TiNP/Cu复合材料。将Cu-Ti混合粉球磨48h后Ti的结构特征已不存在,形成一种亚稳态的Cu-Ti合金粉,经950℃二次渗氮后形成Cu-TiN合金粉末。将Cu-TiN合金粉末压制烧结后与外加法制备的TiNP/Cu复合材料性能对比表明:采用原位渗氮法制备TiNP/Cu复合材料具有较高的密度、硬度以及拉伸强度,但电导率低于外加法制备的TiNP/Cu复合材料。

关键词(KeyWords)： TiN;铜基复合材料;渗氮;制备;性能

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(50471048);; 天津高等学校科技发展基金(20060904)

作者(Author): 刘德宝,陈民芳,沈荣臻,崔春翔

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