曹军,范俊玲,刘志强

• 1:河南理工大学机械与动力工程学院
• 2:焦作大学化工与环境工程学院

摘要(Abstract)：

利用扫描电镜、强度测试仪分析了高纯铜线与微Sn合金铜线不同热处理温度下组织结构及强度、伸长率的差异,研究了高纯铜线、微Sn合金铜线再结晶行为及微量合金元素Sn对高纯铜线再结晶温度的影响机理。结果表明:Sn原子与铜原子间的化学交互作用与弹性交互作用,引起高纯铜的点阵畸变,阻碍再结晶过程中铜的晶界迁移,抑制再结晶和晶粒长大,使微Sn合金铜线再结晶温度由高纯铜线的400℃提高至450℃,且高纯铜线在热处理过程中晶粒增长与热处理时间呈四次方关系;微量Sn合金减少了无空气焊球热影响区长度,热影响区长度由150μm减少至120μm。

关键词(KeyWords)： 高纯铜线;微Sn合金铜线;热影响区;再结晶

Abstract:

Keywords:

基金项目(Foundation): 甘肃省科技攻关项目(2GSO64-A52-05)

作者(Author): 曹军,范俊玲,刘志强

DOI: 10.13289/j.issn.1009-6264.2015.05.018

参考文献(References)：

• [1]Murali S,Srikanth N,Charles J.Grains deformation substructures and slip bands observed in thermosonic copper ball bonding[J].Materials Characterization,2003,50(1):39-50.
• [2]曹军,丁雨田,卢振华,等.组织和温度对Cu表面氧化速率的影响[J].材料热处理学报,2011,32(12):147-150.CAO Jun,DING Yu-tian,LU Zhen-hua,et al.Effect of microstructure and temperature on oxidation behavior of pure copper[J].Transactions of Materials and Heat Treatment,2012,23(12):147-150.
• [3]Li J H,Duan J A,Han L,et al.Microstructural characteristics of Au/Al bonded interfaces[J].Materials Characterization,2007,58(2):103-107.
• [4]Li J H,Wang R S,Hu H,et al.The law of ultrasonic energy conversion in thermosonic flip chip bonding interfaces[J].Microelectronic Engineering,2009,86(10):2063-2066.
• [5]Li J H,Han L,Zhong J.Ultrasonic power features of wire bonding and thermosonic flip chip bonding in microelectronics packaging[J].Journal of Central South University of Technology,2008,15:684-688.
• [6]Holger Gaul,Schneider M,Ramelow,et al.Analysis of the friction processes in ultrasonic wedge/wedge bonding[J].Microsystem Technology,2009,15(5):771-775.
• [7]Hang C J,Song W H,Lum I,et al.Effect of electronic flame off parameters on copper bonding wire:Free-air ball deformability,heat affected zone length,heat affected zone breaking force[J].Microelectronic Engineering,2009,86(10):2094-2103.
• [8]Hung F Y,Lui T S,Chen L H,et al.An investigation into the crystallization and electric flame-off characteristics of 20 um copper wires[J].Microelectronics Reliability,2011 51,(1):21-24.
• [9]曹军,丁雨田,郭庭彪.铜线性能及键合参数对键合质量影响研究[J].材料科学与工艺,2012,20(4):76-79.CAO Jun,DING Yu-tian,GUO Ting-biao.Effect of copper properties and bonding parameters on bonding quality[J].Materials Science and Technology,2012,20(4):76-79.
• [10]Qin I,Cohen I M,Ayyaswamy P S.Ball size and HAZ as functions of EFO parameters for gold bonding wire[J].Advances in Electronic Packaging,1997,19(1):391-398.
• [11]LIU Dong,CHEN Hai-bin,WONG Fei,et al.Effect of heat affected zone on the mechanical properties of copper bonding wire[C]∥Electronic Components and Technology Conference(ECTC),2011 IEEE 61st,2011:1523-1528.
• [12]Zhong Z W,Ho H M,Tan Y C,et al.Study of factors affecting the hardness of ball bonds in copper wire bonding[J].Microelectronic Engineering,2007,84(2):368-374.
• [13]毛卫民,赵新兵.金属的再结晶与晶粒长大[M].北京:冶金工业出版社,1994.

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