彭健,王日初,韦小凤,刘锐,王檬

• 1:中南大学材料科学与工程学院
• 2:江西理工大学材料科学与工程学院

摘要(Abstract)：

研究Cu/AuSn20/Ni焊点在120、160和200℃下老化退火时金属间化合物(IMC)层的组织形貌、生长动力学以及焊点剪切性能。结果表明:在老化退火过程中,焊点Cu/AuSn20上界面形成AuCu和Au(Cu,Sn)复合IMC层,Ni/AuSn20下界面形成(Ni,Au,Cu)3Sn2四元IMC层;IMC层厚度随着退火时间延长而逐渐增大,其生长动力学分析表明AuCu层和Au(Cu,Sn)层的生长机制为体积扩散,而(Ni,Au,Cu)3Sn2层的生长机制为反应扩散;IMC层的长大速率随温度升高而增大;焊点的室温剪切强度随AuCu和Au(Cu,Sn)层厚度增大而大幅降低,剪切断裂发生在Cu/AuSn20界面。

关键词(KeyWords)： Cu/AuSn20/Ni焊点;老化退火;生长动力学;金属间化合物(IMC);剪切强度

Abstract:

Keywords:

基金项目(Foundation): 国家军品配套项目(JPPT-125-GH-039)

作者(Author): 彭健,王日初,韦小凤,刘锐,王檬

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