潘龙,何闻,顾邦平

• 1:浙江省先进制造技术重点研究实验室浙江大学流体动力与机电系统国家重点实验室

摘要(Abstract)：

研究了电流脉冲对淬火45碳钢试样位错密度和表面残余应力的影响。根据XRD图谱,采用Modified Williamson-Hall(MWH)方法计算位错密度,进一步结合微观组织结构,分析了位错密度和残余应力的关系。结果表明,电流脉冲处理前后,位错密度由1.21×1015m-2变为0.80×1015m-2,表面残余应力σx由-250 MPa降低到-142 MPa,σy由-363 MPa降低到-172 MPa。与热处理相比,电流脉冲处理的试样位错密度和残余应力的降低率都比较大,表明电流脉冲除了产生热作用外,还产生了非热作用。位错密度和残余应力存在一定关系,符合Kocks-Mecking模型。电流脉冲处理过程中,位错激活运动,导致位错湮灭,位错密度降低,是残余应力降低的主要因素。

关键词(KeyWords)： 位错密度;残余应力;电流脉冲;XRD

Abstract:

Keywords:

基金项目(Foundation): 航空科学基金(20140876003);; 国家自然科学基金(50675200);国家自然科学基金创新研究群体科学基金(51221004)

作者(Author): 潘龙,何闻,顾邦平

DOI: 10.13289/j.issn.1009-6264.2015.s1.026

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