王海燕,石永华,崔国涛,龚长青,刘志勇

• 1:菏泽学院机电工程学院
• 2:华南理工大学机械与汽车工程学院

摘要(Abstract)：

将直径为300、500和760μm的SAC305(Sn3.0Ag0.5Cu)焊球在ENEPIG/Cu焊盘上进行3次回流焊形成SAC305/ENEPIG/Cu焊点，并在185℃对焊点进行了时效(0～1000 h)处理，研究了焊球直径对回流及时效后微焊点界面金属间化合物(IMC)反应和演变的影响，分析了不同焊球直径的焊点在不同剪切速率下(0.2和20 mm/s)的剪切强度与断裂模式。结果表明：随焊球直径减小和时效时间延长，焊点界面金属间化合物(IMC)由单相(Cu, Ni)_6Sn_5向(Ni, Cu)_3Sn_4和(Cu, Ni)_6Sn_5两相演化，IMC生长速率随焊点尺寸的增大而减小，表现出明显尺寸效应；焊点剪切强度随剪切速率减小和时效时间增加而降低，且大尺寸焊点剪切强度的下降程度明显弱于小尺寸焊点，在高速(20 mm/s)剪切条件下，所有尺寸焊点时效300 h后断面均呈韧性断裂。

关键词(KeyWords)： 微焊点;金属间化合物;剪切强度;尺寸效应

Abstract:

Keywords:

基金项目(Foundation): 山东省自然科学基金(ZR2021ME060)

作者(Author): 王海燕,石永华,崔国涛,龚长青,刘志勇

DOI: 10.13289/j.issn.1009-6264.2023-0007

参考文献(References)：

• [1] Maeshima T,Ikehata H,Terui K,et al.Effect of Ni to the Cu substrate on the interfacial reaction with Sn-Cu solder[J].Materials and Design,2016,103:106-113.
• [2] 周敏波，赵星飞，陈明强，等.电子封装跨尺度凸点结构Sn3.0Ag0.5Cu/Cu微互连焊点界面IMC生长与演化及力学行为的尺寸效应[J].机械工程学报，2022,58(2):259-268.ZHOU Min-bo,ZHAO Xing-fei,CHEN Ming-qiang,et al.Size effects of growth and evolution of interfacial intermetallic compound and the mechanical behavior of bump structure Sn3.0Ag0.5Cu/Cu cross-scale joints in electronic packages[J].Journal of Mechanical Engineering,2022,58(2):259-268.
• [3] Ho C E,Hsieh W Z,Yang T H.Depletion and phase transformation of a submicron Ni(P) film in the early stage of soldering reaction between Sn-Ag-Cu and Au/Pd(P)/Ni(P)/Cu[J].Electronic Materials Letters,2015,11(1):155-163.
• [4] Dong H J,Li Z L,Song X G,et al.Grain morphology and mechanical strength of high-melting-temperature intermetallic joints formed in asymmetrical Ni/Sn/Cu system using transient liquid phase soldering process[J].Journal of Alloys and Compounds,2017,723:1026-1031.
• [5] Pang J,Low T H,Xiong B S,et al.Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure,IMC and strength[J].Thin Solid Films,2004,462:370-375.
• [6] Liang Z,Xue S B,Zeng G,et al.Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging[J].Journal of Alloys and Compounds,2012,510(1):38-45.
• [7] Joo S M,Kim H K.Shear deformation behavior of a Sn-3Ag-0.5Cu single solder ball at intermediate strain rates[J].Materials Science and Engineering A,2011,528(6):2711-2717.
• [8] Nishikawa H,Iwata N.Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-Ag Cu solder on a Cu Pad[J].Journal of Materials Processing Technology,2015,215:6-11.
• [9] Yang C,Le F,Lee S.Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints[J].Microelectronics Reliability,2016,62:130-140.
• [10] Yin L,Wei S,Xu Z,et al.The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures[J].Journal of Materials Science:Materials in Electronics,2013,24(4):1369-1374.
• [11] Li X,Sun F,Liu Y,et al.Geometrical size effect on the interface diffusion of micro solder joint in electro-thermal coupling aging[J].Journal of Materials Science:Materials in Electronics,2014,25(9):3742-3746.
• [12] Huang J Q,Zhou M B,Liang S B,et al.Size effects on the interfacial reaction and microstructural evolution of Sn-ball/Sn3.0Ag0.5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing temperature[J].Journal of Materials Science:Materials in Electronics,2018,29(9):7651-7660.
• [13] Jing H Y,Guo H J,Wang L X,et al.Influence of Ag-modified graphene nanosheets addition into Sn-Ag-Cu solders on the formation and growth of intermetallic compound layers[J].Journal of Alloys and Compounds,2017,702:669-678.
• [14] Xiong M Y,Zhang L.Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging[J].Journal of Materials Science,2019,54(2):1741-1768.
• [15] Chung B M,Baek Y H,Choi J,et al.Effects of Pd(P) thickness on the microstructural evolution between Sn-3Ag-0.5Cu and Ni(P)/Pd(P)/Au surface finish during the reflow process[J].Journal of Electronic Materials,2012,41(12):3348-3358.
• [16] Yoon J W,Back J H,Jung S B.Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints[J].Journal of Materials Science:Materials in Electronics,2018,29(6):4724-4731.
• [17] Xu T,Hu X W,Li Y L,et al.The growth behavior of interfacial intermetallic compound between Sn-3.5Ag-0.5Cu solder and Cu substrate under different thermal-aged conditions[J].Journal of Materials Science:Materials in Electronics,2017,28(24):18515-18528.
• [18] Huang M L,Yang F.Size effect on interfacial reactions of Sn-3.0Ag-0.5Cu solder balls on Cu and Ni-P pads[J].Journal of Materials Science:Materials in Electronics,2015,26(2):933-942.
• [19] Li X P,Xia J M,Zhou M B,et al.Solder volume effects on the microstructure evolution and shear fracture behavior of ball grid array structure Sn-3.0Ag-0.5Cu solder interconnects[J].Journal of Electronic Materials,2011,40(12):2425-2435.
• [20] Hu X W,Xu T,Jiang X X,et al.Interfacial reaction and IMCs growth behavior of Sn3Ag0.5Cu/Ni solder bump during aging at various temperatures[J].Journal of Materials Science:Materials in Electronics,2016,27(5):4245-4252.
• [21] Park Y S,Kwon Y M,Moon J T,et al.Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability[C]//Electronic Components and Technology Conference (ECTC 2010),Las Vegas,2010:1436-1441.
• [22] Zhang R,Guo F,Liu J,et al.Morphology and growth of intermetallics at the interface of Sn-based solders and Cu with different surface finishes[J].Journal of Electronic Materials,2009,38(2):241-251.
• [23] Hu X W,Xu T,Leon M,et al.Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates[J].Journal of Alloys and Compounds,2017,690:720-729.
• [24] Yoon J W,Noh B I,Jung S B.Effects of third element and surface finish on interfacial reactions of Sn-Ag-xCu (or Ni)/(Cu or ENIG) solder joints[J].Journal of Alloys and Compounds,2010,506(1):331-337.
• [25] Zhu Q S,Zhang Z F,Shang J K,et al.Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces[J].Materials Science and Engineering A,2006,435:588-594.
• [26] Xu T,Hu X,Li J,et al.Fracture behavior and mechanical strength of sandwich structure solder joints with Cu-Ni(P) coating during thermal aging[J].Journal of Materials Science:Materials in Electronics,2020,31(5):3876-3889.
• [27] Tian Y,Hang C,Wang C,et al.Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing[J].Materials Science and Engineering A,2011,529:468-478.
• [28] Peng W Q,Monlevade E,Marques M E.Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu[J].Microelectronics Reliability,2007,47(12):2161-2168.
• [29] Kim J M,Jeong M H,Yoo S,et al.Effects of surface finishes and loading speeds on shear strength of Sn-3.0Ag-0.5Cu solder joints[J].Microelectronic Engineering,2012,89(1):55-57.
• [30] Yin L M,Zhang X P,Lu C.Size and volume effects on the strength of microscale lead-free solder joints[J].Journal of Electronic Materials,2009,38(10):2179-2183.
• [31] Qin H B,Zhang X P,Zhou M B,et al.Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints[J].Materials Science and Engineering A,2014,617:14-23.
• [32] Zou H F,Zhang Z F.Effects of aging time,strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints[J].Microelectronic Engineering,2010,87(4):601-609.
• [33] Tashtoush T H.Effect of lead-free solder joints size and configuration on mechanical properties,microstructure,and aging kinetics[D].New York:State University of New York at Binghamton,2013.
• [34] Tao Q B,Benabou L,Vivet L,et al.Effect of Ni and Sb additions and testing conditions on the mechanical properties and microstructures of lead-free solder joints[J].Materials Science and Engineering A,2016,669:403-416.

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