时效时间对Cu-Be-Ni合金组织和性能的影响Effect of aging time on microstructure and properties of Cu-Be-Ni alloy
朱科研,李兆鑫,王琳琳,贾焱迪,周延军,周志云,牛立业
摘要(Abstract):
分别采用电导率仪、布氏硬度计、拉伸试验机、光学显微镜(OM)、扫描电镜(SEM)等研究了时效时间对Cu-Be-Ni合金导电率、强度和显微组织的影响,观察分析了时效后合金拉伸断面的特征。结果表明:经950℃固溶保温60 min及后续460℃时效不同时间后,Cu-Be-Ni合金显微组织中的孪晶数量随时效时间延长先增加后减少,尺寸逐渐增大,合金断裂方式均为韧性断裂,且韧窝密度逐渐增大;在试验范围内,该合金在时效120 min时具有优异的综合性能:导电率66. 7%·IACS,硬度257 HBW,强度872 MPa,伸长率25%。
关键词(KeyWords): Cu-Be-Ni合金;时效;显微组织;导电率;强度
基金项目(Foundation): 河南省高等学校重点科研项目(19A430012);; 河南省杰出人才创新基金(182101510003)
作者(Author): 朱科研,李兆鑫,王琳琳,贾焱迪,周延军,周志云,牛立业
DOI: 10.13289/j.issn.1009-6264.2019-0172
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