杨晓华,杨思佳,兑卫真,李晓延

• 1:福州大学测试中心
• 2:北京工业大学材料学院

摘要(Abstract)：

对热循环条件下Sn3.0Ag0.5Cu/Cu焊接接头界面金属间化合物(IMC)进行观察及力学性能实验,研究界面金属间化合物生长及接头抗拉强度的演变规律。改变保温时间、最低极限温度等热循环参量来做对比试验,同时在热循环上限温度下做等温时效试验与热循环试验对比。结果表明:随着循环周次的增加,界面金属间化合物的等效厚度不断增加,且下限温度越低界面金属间化合物生长越快,接头抗拉强度先稍有增加后不断下降;当在上限温度保温相同时间时,等温时效条件下界面金属间化合物的生长速率比热循环条件下快,未经历低温过程,界面原子扩散一直保持相对较快的速度。

关键词(KeyWords)： 无铅焊料;热循环;等温时效;显微组织;力学性能

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金(51575011);; 北京市自然科学基金(2162002)

作者(Author): 杨晓华,杨思佳,兑卫真,李晓延

DOI: 10.13289/j.issn.1009-6264.2017-0518

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