李帅,闫焉服,赵永猛,许媛媛

• 1:河南科技大学材料科学与工程学院

摘要(Abstract)：

基于自制多场耦合装置,研究了Sn-3.0Ag-0.5Cu/Cu钎焊接头在多场耦合时效过程中界面金属间化合物(IMC)的显微组织变化和生长行为。结果表明,在相同的时效时间内,时效温度越高,界面IMC生长越快。当钎焊接头在85、125和150℃多场耦合时效时,IMC的形貌由扇贝状转变为较平整的层状。在多场耦合时效过程中,在Cu6Sn5层中发现了白色的Ag3Sn颗粒,而且普遍出现在Cu6Sn5凹陷处。界面IMC的生长厚度与时效时间的平方根成线性关系,其生长受扩散机制影响。多场耦合时效降低了界面IMC的激活能,整个IMC层的激活能为49 kJ/mol。

关键词(KeyWords)： 多场耦合;显微组织;界面IMC;激活能

Abstract:

Keywords:

基金项目(Foundation): 国家自然基金资助项目(51175151)

作者(Author): 李帅,闫焉服,赵永猛,许媛媛

DOI: 10.13289/j.issn.1009-6264.2014.05.005

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