NH3 Plasma Surface Treatments of Engineering Fluoropolymers: A Way to Enhance Adhesion of Ni or Cu Thin Films Deposited by Electroless PlatingNH3 Plasma Surface Treatments of Engineering Fluoropolymers: A Way to Enhance Adhesion of Ni or Cu Thin Films Deposited by Electroless Plating
Maurice Romand,Marlene Charbonnier,Yves Goepfert
摘要(Abstract):
关键词(KeyWords):
基金项目(Foundation):
作者(Author): Maurice Romand,Marlene Charbonnier,Yves Goepfert
参考文献(References):
- 1Scheirs J.Modern Fluoropolymers:High Performance Polymers for Diverse Applications.New York:John Wiley&Sons,1997.
- 2Hougham G Fluoropolymers2.New York:Kluwer
- Academic/Plenum Publishers,2002.
- 3Gangal S V.Polytetrafluoroethylene homopolymer of tetrafluoroethylene.In:Mark H F and Kroschewitz J I,Eds.Encyclopedia of Polymer Science and Engineering,Vol.16,New York:John Wiley&Sons,1989,577-600.
- 4Blanche!T H.Polytetrafluoroethylene.In:Olabisi O,Ed.Handbook of Thermoplastics,New York:Marcel Dekker Inc.,1997,981-1000.
- 5Brewis D M and Mathieson I.Adhesion properties of fluoropolymers,Chapter7.In:Scheirs J,Ed.Modern Fluoropolymers:High Performance Polymers for Diverse Applications,Chichester:John Wiley&Sons,1997,166-172.
- 6Sacher E.Fluoropolymer metallization for microelectronics applications.Prog.Surf.Sci.,1994,47:273-300.
- 7Kang E T and Zhang Y.Surface modification of fluoropolymers via molecular design.Adv.Mater.,2000,12(20):1481-1494.
- 8Kuzrnik J J.Plating on plastics-Chapter14.In:Mallory G O and Hajdu J B,Eds.Electroless Plating:Fundamentals and Applications,Orlando:American Electroplaters and Surface Finishers Society,1990,377-399.
- 9Charbonnier M,Romand M,Alami M and Tran Minh Due.Surface modification of poly(tetrafluoroethylene)in RF glow-discharge(H2,He,Ar,O2,N2,NH3)plasmas.In:Mittal K L,Ed.Polymer Surface Modification:Relevance to Adhesion,Vol.2,Utrecht,The Netherlands:VSP,2000,3-27.
- 10Charbonnier M,Romand M and Alami M.Plasma surface modification of poly(tetrafluoroethylene)substrates:A route for electroless plating.In:Mittal K L,Ed.Polymer Surface Modification:Relevance to Adhesion,Vol.2,Utrecht,The Netherlands:VSP,2000,29-43.
- 11Subrahmanyan S,Dillard J G,Love B J,Romand M and Charbonnier M.Transcience of plasma surface modification as an adhesion promoter for polychlorotrifluorethylene.J.Vac.Sci.Technol.,2002,A20(3):707-713.
- 12Romand M,Charbonnier M and Goepfert Y.Plasma and VUV pretreatments of polymer surfaces for adhesion enhancement of electrolessly deposited Ni or Cu films.In:Sacher E,Ed.Metallization of Polymers2,New York:Kluwer Academic/Plenum Publishers,2002,191-205.
- 13Charbonnier M,Goepfert Y and Romand M.New developments in the adhesion promotion of electroless Ni or Cu films to polyimide substrates.In:Mittal K L,Ed.Polyimides and Other High Temperature Polymers,Vol.2,Utrecht,The Netherlands:VSP,2003,289-314.
- 14Nemat-Nasser S.Micromechanics of actuation of ionic polymer-metal composites.J.Appl.Physics,2002,92(5):2892-2915.
- 15Charbonnier M,Romand M,Esrom H and Seebock R.
- Functionalization of polymer surfaces using excimer VUV systems and silent discharges.Application to electroless metallization.J.Adhesion,2001,75:381-404.
- 16Charbonnier M,Romand M,Kogelschatz U,Esrom H and Seebock R.New approaches for electroless plating processes by activation of polymer surfaces using low pressure plasma and dielectric-barrier discharge devices.In:Mittal K L,Ed.Metallized Plastics7:Fundamental and Applied Aspects,The Netherlands:VSP,2001,3-26.
- 17Inagaki N,Tasaka S and Kawai H.Improved adhesion of poly(tetrafluoroethylene)by ammonia plasma treatment.J.Adhesion Sci.Technol.,1989,3:637-649.
- 18Gengenbach T R,Xie X,Chatelier R C and Griesser H J.Evolution of the surface composition and topography of perfluorinated polymers following ammonia-plasma treatment.J.Adhesion Sci.Technol.,1994,8:305-328.
- 19Tatoulian M,Cavalli F,Lorang G,Amouroux J and Arefi-Khonsari F.Copper metallization of plasma-treated fluorinated polymers.Study of the interface and adhesion measurements.In:Mittal K L,Ed.Polymer Surface Modification:Relevance to Adhesion,Vol.2,The Netherlands:VSP,2000,189-197.
- 20Vargo T G,Gardella J A,Calvert J M and Chan M S.Adhesive electroless metallization of fluoropolymeric substrates.Science,1993,262:1711-1712.
- 21Yang G H,Kang E T,Neoh K G,Zhang Y and Tan K L.Surface graft copolymerization of poly(tetrafluoroethylene)films with N-containing vinyl monomers for the electroless plating of copper.Langmuir,2001,17:211-218.
- 22Agrawal D C and Raj R.Measurement of the ultimate shear strength of a metal-ceramic interface.Acta Metall.1989,37(4):1265-1270.
- 23Wheeler D R and Osaki H.Intrinsic bond strength of metal films on polymer substrates:A new method of measurement.In:Sacher E,Pireaux J J and Kowalczyk S P,Eds.Metallization of Polymers,Symposium Series440,Washington:ACS,1990,500-512.
- 24Goepfert Y,Leonard D,Charbonnier M and Romand M.Adhesion of brittle metal films to plastics:on the use of a stretch deformation test combined with an electrical approach.In:Chaudhury M K,Ed.Proc.27th Annual Meeting of the Adhesion Society,Blacksburg:The Adhesion Society,2004,235-237.
文章评论(Comment):
|
||||||||||||||||||
|
||||||||||||||||||
扩展功能
本文信息
服务与反馈
本文关键词相关文章
本文作者相关文章
中国知网
分享