黄国杰,肖翔鹏,马吉苗,赵洋

• 1:北京有色金属研究总院有色金属材料制备加工国家重点实验室
• 2:江西理工大学工程研究院
• 3:宁波兴业盛泰集团有限公司

摘要(Abstract)：

研究了不同固溶工艺条件对Cu-1.4Ni-1.2Co-0.6Si合金显微组织的影响,对合金固溶-时效后的显微硬度和导电率进行了分析,并采用电子衍射及透射电镜分析其显微组织。结果表明:合金铸态组织以等轴晶为主,热轧变形组织中存在许多细小析出相。热轧合金在固溶处理过程中基体变形组织发生再结晶和晶粒长大,且随着固溶温度升高,析出相固溶量增加,至975℃时,析出相粒子基本回溶到基体中。合金中的析出相与Cu-Ni-Si合金具有相同的结构和形貌,与Cu基体的位向关系为:[001]Cu//[110]p,(010)Cu//(001)p;[112]Cu//[32 4]p,(110)Cu//(2 11)p。合金最佳固溶-时效处理工艺为975℃×1.5 h+500℃×4 h时效,在此工艺条件下,合金显微硬度为232 HV,相对导电率为49%IACS。

关键词(KeyWords)： Cu-1.4Ni-1.2Co-0.6Si合金;显微组织;显微硬度;时效

Abstract:

Keywords:

基金项目(Foundation): 科研院所技术开发研究专项基金(2011DIA5K023)

作者(Author): 黄国杰,肖翔鹏,马吉苗,赵洋

DOI: 10.13289/j.issn.1009-6264.2014.08.011

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