基于团簇式设计方法的高强导电Cu-Ti合金成分优化Composition optimization of high-strength and conductive Cu-Ti alloys using a cluster-formula approach
钱圣男,李冬梅,王清,董闯,陈勃,侯冬芳,刘永健,谢巧英,陈清香,王华
摘要(Abstract):
采用了一种新的团簇成分式合金设计方法,对高强导电Cu-Ti合金进行了成分优化和实验验证。根据团簇加连接原子结构模型,Cu-Ti面心立方固溶体的高稳定性化学近程序结构单元可表述为团簇成分式[Ti-Cu_(12)]Cu_(3,6),其中[Ti-Cu_(12)]为以溶质原子Ti为中心的第一近邻配位多面体团簇,并搭配以3或6个连接原子。经过固溶处理(1173 K/2 h)和时效(723 K/4 h)处理,合金[Ti-Cu_(12)]Cu3(质量分数Cu-4.8Ti)的维氏显微硬度为304 MPa,导电率为9.8%IACS,[Ti-Cu_(12)]Cu_6(Cu-4.0Ti)的维氏硬度为283 MPa,导电率达11.3%IACS,其中后者导电性能相当于日本的Cu-3.39Ti合金,且成分点位于性能对成分变化不敏感区域。
关键词(KeyWords): 高强导电合金;Cu-Ti合金;合金设计;团簇成分式
基金项目(Foundation): 国家国际科技合作专项(2015DFR60370);; 辽宁省基金(2015020202);; 中央高校基本科研业务费专项资金(DUT16ZD212)
作者(Author): 钱圣男,李冬梅,王清,董闯,陈勃,侯冬芳,刘永健,谢巧英,陈清香,王华
DOI: 10.13289/j.issn.1009-6264.2016.11.002
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