热轧态Cu-Ni-Si-Mg合金的时效动力学Aging kinetics of Cu-Ni-Si-Mg alloy
王俊峰,贾淑果,陈少华,刘平,宋克兴
摘要(Abstract):
对经过连铸连轧处理的Cu-Ni-Si-Mg合金进行时效,研究了时效温度和时效时间对该合金组织和性能的影响,并对该合金在不同温度下的时效动力学进行了分析。结果表明:合金在450℃时效2 h时能够获得较好的综合性能,其显微硬度和导电率分别为230 HV和35%IACS;通过对合金在时效过程中导电率的变化规律的分析,推导出合金在不同温度下时效的相变动力学方程和导电率方程,在此基础上做出了动力学"S"曲线和导电率方程曲线,该导电率方程与试验值吻合。
关键词(KeyWords): Cu-Ni-Si-Mg合金;时效析出;导电率方程;相变动力学
基金项目(Foundation): 国家高新技术研究发展计划(863)资助项目(2006AA03Z528);; 河南省教育厅科技攻关项目(2009A430007);; 河南科技大学科研创新能力培育基金项目(2010CZ0008)
作者(Author): 王俊峰,贾淑果,陈少华,刘平,宋克兴
DOI: 10.13289/j.issn.1009-6264.2012.07.018
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