涂明武,王东锋

• 1:空军第一航空学院二系

摘要(Abstract)：

通过分析时效期间Cu-Ni-Si合金显微硬度、导电率以及微观组织的变化,研究了析出相和再结晶行为的相互作用。结果表明,时效初期析出相对随后的再结晶过程具有强烈阻碍作用。在450、550℃较低温度时效时,合金发生原位再结晶,析出相在其体积分数略微升高或不变的情况下发生粗化;导电率上升趋势为先快后慢并趋于稳定,因而其变化曲线上无峰值出现;显微硬度则由于时效后期析出颗粒粗化,析出强化效果降低而出现峰值。在750℃高温时效时,合金发生不连续再结晶,析出相则在体积分数略有降低的情况下发生粗化;导电率先快速上升后缓慢下降因而出现峰值;而显微硬度由于析出物迅速粗化而一开始就表现为持续下降。

关键词(KeyWords)： Cu-Ni-Si合金;析出;再结晶;显微硬度;导电率

Abstract:

Keywords:

基金项目(Foundation): National Natural Science Foundation of China (50071026)

作者(Author): 涂明武,王东锋

DOI: 10.13289/j.issn.1009-6264.2011.04.014

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